Oxide semiconductor
First Claim
1. An oxide semiconductor comprising:
- an aggregation of a plurality of crystals,wherein the plurality of crystals includes indium, gallium and zinc,wherein each of the plurality of crystals has a size larger than or equal to 1 nm and smaller than or equal to 3 nm,wherein the plurality of crystals has no orientation, andwherein a boundary between the plurality of crystals is not observed in a TEM image of the oxide semiconductor.
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Accused Products
Abstract
To provide an oxide semiconductor with a novel structure. Such an oxide semiconductor is composed of an aggregation of a plurality of InGaZnO4 crystals each of which is larger than or equal to 1 nm and smaller than or equal to 3 nm, and in the oxide semiconductor, the plurality of InGaZnO4 crystals have no orientation. Alternatively, such an oxide semiconductor is such that a diffraction pattern like a halo pattern is observed by electron diffraction measurement performed by using an electron beam with a probe diameter larger than or equal to 300 nm, and that a diffraction pattern having a plurality of spots arranged circularly is observed by electron diffraction measurement performed by using an electron beam with a probe diameter larger than or equal to 1 nm and smaller than or equal to 30 nm.
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Citations
6 Claims
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1. An oxide semiconductor comprising:
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an aggregation of a plurality of crystals, wherein the plurality of crystals includes indium, gallium and zinc, wherein each of the plurality of crystals has a size larger than or equal to 1 nm and smaller than or equal to 3 nm, wherein the plurality of crystals has no orientation, and wherein a boundary between the plurality of crystals is not observed in a TEM image of the oxide semiconductor. - View Dependent Claims (2, 3, 4)
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5. An oxide semiconductor comprising:
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indium, gallium and zinc, wherein a diffraction pattern having a plurality of spots circularly arranged is observed when an electron diffraction measurement is performed on the oxide semiconductor by using an electron beam with a probe diameter larger than or equal to 1 nm and smaller than or equal to 30 nm, wherein a diffraction pattern with no spot is observed when an electron diffraction measurement is performed on the oxide semiconductor by using an electron beam with a probe diameter larger than or equal to 300 nm, and wherein a grain boundary is not observed in a TEM image of the oxide semiconductor. - View Dependent Claims (6)
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Specification