White light emitting device and white light source module using the same

• US 9,392,670 B2
• Filed: 10/26/2012
• Issued: 07/12/2016
• Est. Priority Date: 12/05/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Yoo, Chul Hee, Jeong, Young June, Park, Young Sam, Han, Seong Yeon, Kim, Ho Yeon, Hahm, Hun Joo, Kim, Hyung Suk
• Primary Examiner(s): Sember, Thomas M
• Application Number:
  US13/661,346
• Publication Number:
  US 20130258211A1
• Time in Patent Office: 1,355 Days
• Field of Search: 362/84, 362 971- 973, 362/293, 362/267, 362/310, 362/800, 257 98-100, 257/E33.061, 313485-487, 313502-504
• US Class Current: 1/1
• CPC Class Codes: C09K 11/0883 Arsenides; Nitrides; Phosphides
• CPC Class Codes: C09K 11/7731 with alkaline earth metals
• CPC Class Codes: C09K 11/77347 Silicon Nitrides or Silicon Oxynitrides
• CPC Class Codes: C09K 11/77348 Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133609 including means for improving the color mixing, e.g. white
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H05B 33/12 Light sources with substantially two-dimensional radiating surfaces
• CPC Class Codes: Y02B 20/00 Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

Abstract

A white light emitting device including: a blue light emitting diode chip having a dominant wavelength of 443 to 455 nm; a red phosphor disposed around the blue light emitting diode chip, the red phosphor excited by the blue light emitting diode chip to emit red light; and a green phosphor disposed around the blue light emitting diode chip, the green phosphor excited by the blue light emitting diode chip to emit green light, wherein the red light emitted from the red phosphor has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905) and (0.4794, 0.4633) based on the CIE 1931 chromaticity diagram, and the green light emitted from the green phosphor has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316) and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

Claims

1. A method for manufacturing a white light source module, the method comprising:

disposing a blue LED chip on a substrate, the blue LED chip having a full width at half-maximum (FWHM) of 10 to 30 nm;

selecting a red phosphor having a FWHM of 50 to 200 nm and such that red light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905), and (0.4794, 0.4633) based on CIE 1931 color chromaticity diagram,

wherein the red phosphor is at least one selected from the group consisting of;

CaAlSiN₃;

Eu and Ca₂Si₅N₈;

Eu;

selecting a green phosphor having a FWHM of 30 to 100 nm and such that green light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316), and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram; and

disposing a mixture of the red phosphor and the green phosphor around the blue LED chip, wherein the red phosphor and the green phosphor are excited by light emitted from the blue LED chip and emit red light and green light, respectively, and the blue LED chip in combination with the red phosphor and the green phosphor emit white light.

2. The method for manufacturing a white light source module according to claim 1, wherein the mixture is a uniform mixture of the red phosphor and the green phosphor.

3. The method for manufacturing a white light source module according to claim 1, wherein the green phosphor is at least one selected from the group consisting of:

SrGa₂S₄;

Eu, β

-SiAlON, and A₂SiO₄;

Eu, wherein A comprises at least one of Ba, Sr, and Ca.

4. The method for manufacturing a white light source module according to claim 1, wherein the blue light emitting diode chip has a dominant wavelength of 443 to 455 nm.

5. A method for manufacturing a white light source module, the method comprising:

disposing a blue LED chip on a substrate, the blue LED chip having a FWHM of 10 to 30 nm;

selecting a red phosphor having a FWHM of 50 to 200 nm and such that red light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905), and (0.4794, 0.4633) based on CIE 1931 color chromaticity diagram;

selecting a green phosphor having a FWHM of 30 to 100 nm and such that green light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316), and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram,

wherein the green phosphor is at least one selected from the group consisting of;

β

-SiAlON, and A₂SiO₄;

Eu, wherein A comprises at least one of Ba, Sr, and Ca; and

disposing a mixture of the red phosphor and the green phosphor around the blue LED chip, wherein the red phosphor and the green phosphor are excited by light emitted from the blue LED chip and emit red light and green light, respectively, and the blue LED chip in combination with the red phosphor and the green phosphor emit white light.

6. The method for manufacturing a white light source module according to claim 5, wherein the mixture is a uniform mixture of the red phosphor and the green phosphor.

7. The method for manufacturing a white light source module according to claim 5, wherein the red phosphor is at least one selected from the group consisting of:

CaAlSiN₃;

Eu, Ca₂Si₅N₈;

Eu, and (Ca, Sr)S;

Eu.

8. The method for manufacturing a white light source module according to claim 5, wherein the blue light emitting diode chip has a dominant wavelength of 443 to 455 nm.

9. A method for manufacturing a white light source module, the method comprising:

disposing a blue LED chip on a substrate, the blue LED chip having a FWHM of 10 to 30 nm;

selecting a red phosphor having a FWHM of 50 to 200 nm, wherein the red phosphor is at least one selected from the group consisting of;

CaAlSiN₃;

Eu and Ca₂Si₅N₈;

Eu;

selecting a green phosphor having a FWHM of 30 to 100 nm, wherein the green phosphor is at least one selected from the group consisting of;

β

-SiAlON, and A₂SiO₄;

Eu, wherein A comprises at least one of Ba, Sr, and Ca; and

disposing a mixture of the red phosphor and the green phosphor around the blue LED chip, wherein the red phosphor and the green phosphor are excited by light emitted from the blue LED chip and emit red light and green light, respectively, and the blue LED chip in combination with the red phosphor and the green phosphor emit white light.

10. The method for manufacturing a white light source module according to claim 9, red light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.5448, 0.4544), (0.7079, 0.2920), (0.6427, 0.2905), and (0.4794, 0.4633) based on CIE 1931 color chromaticity diagram.

11. The method for manufacturing a white light source module according to claim 9, green light emitted from the white light source module has a color coordinate falling within a space defined by four coordinate points (0.1270, 0.8037), (0.4117, 0.5861), (0.4197, 0.5316), and (0.2555, 0.5030) based on the CIE 1931 color chromaticity diagram.

12. The method for manufacturing a white light source module according to claim 9, the disposing of the mixture of the red phosphor and the green phosphor includes forming a resin encapsulant encapsulating the blue light emitting diode chip, wherein the mixture of the green phosphor and the red phosphor are dispersed in the resin encapsulant.

13. The method for manufacturing a white light source module according to claim 9, wherein the blue light emitting diode chip has a dominant wavelength of 443 to 455 nm.