Non-hermetic direct current interconnect

• US 9,393,432 B2
• Filed: 10/30/2009
• Issued: 07/19/2016
• Est. Priority Date: 10/31/2008
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Wahlstrand, Carl D., Skime, Robert M.
• Primary Examiner(s): Holmes, Rex R
• Application Number:
  US12/609,957
• Publication Number:
  US 20100114249A1
• Time in Patent Office: 2,454 Days
• Field of Search: 607 36- 37, 607/45, 607/63, 607115-119
• US Class Current: 1/1
• CPC Class Codes: A61N 1/3752 Details of casing-lead connections
• CPC Class Codes: A61N 1/3754 Feedthroughs

Abstract

A modular implantable medical device (IMD) may include a non-hermetic interconnect. The non-hermetic interconnect may electrically couple a first module and a second module of the modular IMD. A conductor in the non-hermetic interconnect may conduct electrical energy from the first module to the second module under an applied direct current (DC) voltage.

Claims

1. A modular implantable medical device (IMD) comprising:

a first module;

a second module;

an electronic component within one of the first module and the second module; and

a non-hermetic interconnect electrically coupling the first module and the second module, wherein the non-hermetic interconnect comprises a first conductor and a second conductor, wherein the first conductor and the second conductor are separated by at least 1 millimeter for substantially an entire length of the non-hermetic interconnect, and wherein the electronic component applies a DC voltage to at least one of the first conductor and the second conductor to transfer at least one of energy or a communication signal from one of the first module and the second module to the other of the first module and the second module via the at least one of the first conductor and the second conductor wherein at least one of the first conductor and the second conductor connect to at least one of the first module and the second module through a hermetic feedthrough that is comprised of lanthium borate glass.

2. A modular implantable medical device (IMD) comprising:

a first module comprising a first metallic housing and a hermetic feedthrough;

a second module comprising second metallic housing;

an electronic component within one of the first module and the second module; and

a non-hermetic interconnect electrically coupling the first module and the second module, wherein the non-hermetic interconnect comprises a metallic conductor, and wherein the electronic component applies a DC voltage to the metallic conductor to transfer at least one of energy or a communication signal from the first module to the second module via the metallic conductor and wherein the hermetic feedthrough comprises lanthium borate glass.