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MEMS method and structure

  • US 9,394,164 B2
  • Filed: 03/14/2013
  • Issued: 07/19/2016
  • Est. Priority Date: 03/12/2013
  • Status: Active Grant
First Claim
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1. A method of manufacturing a microelectromechanical structure, the method comprising:

  • forming a locker film on a first surface of a first substrate, the first substrate comprising a moveable mass region and a support region;

    patterning the locker film to form a patterned locker film, wherein the patterned locker film extends from the moveable mass region to the support region and wherein the moveable mass region is at least partially exposed by the patterning the locker film;

    after the patterning the locker film, etching through the first substrate to release the moveable mass region from the support region, the etching stopping on the patterned locker film; and

    removing at least a portion of the patterned locker film to release the moveable mass region.

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