Optimization of integrated circuit reliability

• US 9,395,403 B2
• Filed: 10/28/2013
• Issued: 07/19/2016
• Est. Priority Date: 10/28/2013
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Graas, Carole D., Habib, Nazmul, Massey, Deborah M., Massey, John G., Nsame, Pascal A., Wu, Ernest Y., Yashchin, Emmanuel
• Primary Examiner(s): Chiang, Jack
• Assistant Examiner(s): Bowers, Brandon
• Application Number:
  US14/064,337
• Publication Number:
  US 20150115994A1
• Time in Patent Office: 995 Days
• Field of Search: 716/132
• US Class Current: 1/1
• CPC Class Codes: G01R 31/26 Testing of individual semiconductor devices testing or measuring during manufacture or treatment H01L22/00; testing of photovoltaic devices H02S50/10
• CPC Class Codes: G01R 31/2856 Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
• CPC Class Codes: G01R 31/50 Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections testing of sparking plugs H01T13/58

Abstract

A per-chip equivalent oxide thickness (EOT) circuit sensor resides in an integrated circuit. The per-chip EOT circuit sensor determines electrical characteristics of the integrated circuit. The measured electrical characteristics include leakage current. The determined electrical characteristics are used to determine physical attributes of the integrated circuit. The physical attributes, including EOT, are used in a reliability model to predict per-chip failure rate.

Claims

1. A method for optimizing reliability of integrated circuits, the method comprising:

a computer integrating a per-chip equivalent oxide thickness (EOT) circuit sensor into an integrated circuit, wherein the integrated circuit is included in a plurality of integrated circuit chips included in a semiconductor wafer, such that each integrated circuit chip includes one or more per-chip equivalent oxide thickness (EOT) circuit sensor(s);

the computer utilizing the per-chip EOT circuit sensor to determine electrical characteristics of the integrated circuit;

the computer determining physical attributes of the integrated circuit as a function of the determined electrical characteristics; and

the computer accessing EOT sensor circuit data stored in a database and using the EOT sensor circuit data to calculate an oxide thickness value for subsequent reliability modeling of the integrated circuit.

2. The method of claim 1, wherein determining electrical characteristics comprises utilizing an external test apparatus to apply a voltage to the per-chip EOT circuit sensor and to detect a resultant leakage current.

3. The method of claim 1, wherein determining electrical characteristics comprises utilizing Joint Test Action Group (JTAG) self-test functions embedded in the integrated circuit to apply a voltage to the per-chip EOT circuit sensor and to detect a resultant leakage current.

4. The method of claim 1, wherein determining physical attributes comprises utilizing the determined electrical characteristics to calculate equivalent oxide thickness.

5. The method of claim 4, wherein utilizing the determined electrical characteristics comprises inserting a detected value of leakage current into an algorithm for calculating equivalent oxide thickness.

6. The method of claim 1, further comprising the step of:

the computer modeling a predicted integrated circuit failure rate using the determined physical attributes of the integrated circuit;

the computer defines circuits, tests and pass/fail criteria required to meet qualification objectives of a technology and/or product, wherein the qualification plan includes a list of required hardware along with defined tests that the hardware is to be subjected, and pass/fail criteria;

subsequent to qualification testing, the computer reviews test data to determine whether the hardware tested passed or failed the defined test criteria;

if the test hardware fails the defined test criteria, the computer analyzes failures for root cause and corrective actions are implemented;

if the test hardware passes the defined test criteria, the computer reviews reliability models to determine whether the test hardware and current and future manufacturing processes are consistent with expectations for production of the hardware;

subsequent to the test hardware passing the defined test criteria, the computer updates the reliability models;

if the reliability models require updating, the circuit and/or manufacturing process updates under change control are validated using a reliability monitor;

if the reliability models do not require updating, the production readiness phase begins, and a reliability program, which enables scaling for chip failure rate with improved confidence bounds, is executed.

7. The method of claim 6, wherein modeling a predicted integrated circuit failure rate comprises the steps of:

the computer inserting the determined physical attributes in at least one of a plurality of reliability prediction algorithms; and

the computer calculating the predicted integrated circuit failure rate per chip included in a plurality of integrated circuit chips.

8. A computer program product for optimizing reliability of integrated circuits, the computer program product comprising:

one or more computer-readable storage media and program instructions stored on the one or more computer-readable storage media, the program instructions comprising;

program instructions to utilize a per-chip equivalent oxide thickness (EOT) circuit sensor to determine electrical characteristics of an integrated circuit wherein the integrated circuit is included in a plurality of integrated circuit chips included in a semiconductor wafer, wherein each integrated circuit chip includes one or more per-chip EOT circuit sensor(s);

program instructions to determine physical attributes of the integrated circuit as a function of the determined electrical characteristics; and

program instructions access EOT sensor circuit data stored in a database and use the EOT sensor circuit data to calculate an oxide thickness value for subsequent reliability modeling of the integrated circuit.

9. The computer program product of claim 8, further comprising:

program instructions to determine electrical characteristics of the integrated circuit utilizing an external test apparatus to apply a voltage to the per-chip EOT circuit sensor and to detect a resultant leakage current.

10. The computer program product of claim 8, further comprising:

program instructions to determine electrical characteristics utilizing self-test functions embedded in the integrated circuit to apply a voltage to the per-chip EOT circuit sensor and to detect a resultant leakage current.

11. The computer program product of claim 8, further comprising:

program instructions to determine physical attributes of the integrated circuit utilizing the determined electrical characteristics.

12. The computer program product of claim 8, further comprising:

program instructions to insert a detected value of leakage current into an algorithm for calculating equivalent oxide thickness.

13. The computer program product of claim 8, further comprising:

program instructions to model a predicted integrated circuit failure rate using the determined physical attributes of the integrated circuit.

14. The computer program product of claim 13, further comprising:

program instructions to insert the determined physical attributes into at least one of a plurality of reliability prediction algorithms, and thereby calculate the predicted integrated circuit failure rate.

15. A semiconductor wafer structure, the structure comprising:

a plurality of integrated circuit chips included in a semiconductor wafer, wherein each chip includes one or more per-chip equivalent oxide thickness (EOT) circuit sensor;

wherein each EOT circuit sensor is configured to determine electrical characteristics of the integrated circuit and be connected in direct electrical connection to an external test apparatus which applies a voltage to the EOT circuit sensor; and

wherein physical attributes of the integrated circuit are determined using the determined electrical characteristics.

16. The structure of claim 15, the structure further comprising the external test apparatus that applies a voltage to the per-chip EOT circuit sensor and detects a resultant leakage current to determine an electrical characteristic of the plurality of integrated circuit chips.

17. The structure of claim 16, the structure further comprising a plurality of electrical connections that connect the EOT circuit sensors to the test apparatus such that the EOT circuit sensors are in electrical contact with the test apparatus and can pass data that indicate electrical characteristics of a given integrated circuit.

18. The structure of claim 15, the structure further comprising Joint Test Action Group (JTAG) self-test structures embedded in the integrated circuit that applies a voltage to the per-chip EOT circuit sensor and detects a resultant leakage current to determine an electrical characteristic of the plurality of integrated circuit chips.

19. The structure of claim 18, the structure further comprising a plurality of connections that connect the EOT circuit sensors to the JTAG self-test structures such that the EOT circuit sensors are in electrical contact with the JTAG self-test structures and can pass data that indicates electrical characteristics of a given integrated circuit.

20. The structure of claim 15, wherein the EOT circuit sensors comprise one or more of a family of transistors with equivalent RLC (resistance, inductance, capacitance) models, a programmable network unit, and a programmable voltage regulation unit.