Positive photosensitive resin composition and method for forming pattern by using the same

• US 9,395,627 B2
• Filed: 09/03/2014
• Issued: 07/19/2016
• Est. Priority Date: 09/10/2013
• Status: Active Grant

• Current Assignee: CHI MEI Corporation
• Original Assignee: CHI MEI Corporation
• Inventors: Liu, Chi-Ming, Shih, Chun-An
• Primary Examiner(s): Eoff, Anca
• Application Number:
  US14/475,589
• Publication Number:
  US 20150072275A1
• Time in Patent Office: 685 Days
• US Class Current: 1/1
• CPC Class Codes: G03F 7/0233 characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
• CPC Class Codes: G03F 7/0236 Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
• CPC Class Codes: G03F 7/0757 Macromolecular compounds containing Si-O, Si-C or Si-N bonds G03F7/0752 takes precedence

Abstract

The present invention relates to a positive photosensitive resin composition and a method for forming a pattern by using the same. The positive photosensitive resin composition includes a novolac resin (A), a polysiloxane (B), an ortho-naphthoquinone diazide sulfonic acid ester (C) and a solvent (D). The novolac resin (A) includes a xylenol-type novolac resin (A-1). The xylenol-type novolac resin (A-1) is synthesized by polycondensing an aldehyde compound with a xylenol compound.

Claims

1. A positive photosensitive resin composition, comprising:

a novolac resin (A);

a polysiloxane (B), formed by polymerizing a compound having a structure of formula (I);

Si(R₁)_a (OR₂)_4-a (I), wherein R, represents a hydrogen atom, an alkyl group of 1 to 10 carbons, an alkenyl group of 2-10 carbons, an aromatic group of 6 to 15 carbons, an alkyl group having an anhydride group, an alkyl group having an epoxy group, or an alkoxy group having an epoxy group and at least one of the R₁ comprimises an alkyl group having an anhydride group, an alkyl group having an epoxy group, or an alkoxy group having an epoxy group;

R₂ represents a hydrogen atom, an alkyl group of 1 to 6 carbons, an acyl group of 1 to 6 carbons, or an aromatic group of 6 to 15 carbons;

wherein a represents an integer of 1 to 3;

an ortho-naphthoquinone diazide sulfonic acid ester (C); and

a solvent (D), wherein an amount of the polysiloxane (B) is 1 part by weight to 20 parts by weight based on 100 parts by weight of the novolac resin (A).

2. The positive photosensitive resin composition of claim 1, wherein the novolac resin (A) includes a novolac resin derived from xylenol (A-1), and the novolac resin derived from xylenol (A-1) is formed by poly condensing an aldehyde compound with an aromatic hydroxyl compound, wherein the aromatic hydroxyl compound at least comprises a xylenol compound.

3. The positive photosensitive resin composition of claim 2, based on the novolac resin (A) as 100 parts by weight, an amount of the novolac resin derived from xylenol (A-1) is 2 parts by weight to 50 parts by weight.

4. The positive photosensitive resin composition of claim 1, based on the novolac resin (A) as 100 parts by weight, an amount of the ortho-naphthoquinone diazide sulfonic acid ester (C) is 5 parts by weight to 60 parts by weight, and an amount of the solvent (D) is 100 parts by weight to 1000 parts by weight.

5. The positive photosensitive resin composition of claim 1, based on the novolac resin (A) as 100 parts by weight, an amount of the polysiloxane (B) is 2 parts by weight to 15 parts by weight.

6. The positive photosensitive resin composition of claim 1, based on the novolac resin(A) as 100 parts by weight, an amount of the polysiloxane (B) is 3 parts by weight to 10 parts by weight.

7. A method for forming a pattern, and the method is subjecting a positive photosensitive resin composition to a coating process, a pre-bake process, an exposure process, a development process, and a post-bake process in sequence to form the pattern on a substrate, wherein the positive photosensitive resin composition comprising:

a novolac resin (A);

a polysiloxane (B), formed by polymerizing a compound having a structure of formula (I);

Si(R₁)_a (OR₂)_4-a (I), wherein R₁ represents a hydrogen atom, an alkyl group of 1 to 10 carbons, an alkenyl group of 2-10 carbons, an aromatic group of 6 to 15 carbons, an alkyl group having an anhydride group, an alkyl group having an epoxy group, or an alkoxy group having an epoxy group and at least one of the R₁ comprimises an alkyl group having an anhydride group, an alkyl group having an epoxy group, or an alkoxy group having an epoxy group;

R₂ represents a hydrogen atom, an alkyl group of 1 to 6 carbons, an acyl group of 1 to 6 carbons, or an aromatic group of 6 to 15 carbons;

wherein a represents an integer of 1 to 3;

an ortho-naphthoquinone diazide sulfonic acid ester (C); and

a solvent (D), wherein an amount of the polysiloxane (B) is 1 part by weight to 20 parts by weight based on 100 parts by weight of the novolac resin (A).

8. The method for forming a pattern of claim 7, wherein the novolac resin (A) includes a novolac resin derived from xylenol (A-1), and the novolac resin derived from xylenol (A-1) is formed by polycondensing an aldehyde compound with an aromatic hydroxy compound, wherein the aromatic hydroxy compound at least comprises a xylenol compound.

9. The method for forming a pattern of claim 8, based on the novolac resin (A) as 100 parts by weight, an amount of the novolac resin derived from xylenol (A-1) is 2 parts by weight to 50 parts by weight.

10. The method for forming a pattern of claim 7, based on the novolac resin (A) as 100 parts by weight, an amount of the ortho-naphthoquinone diazide sulfonic acid ester (C) is 5 parts by weight to 60 parts by weight, and an amount of the solvent (D) is 100 parts by weight to 1000 parts by weight.

11. The method for forming a pattern of claim 7, based on the novolac resin (A) as 100 parts by weight, an amount of the polysiloxane (B) is 2 parts by weight to 15 parts by weight.

12. The method for forming a pattern of claim 7, based on the novolac resin (A) as 100 parts by weight, an amount of the polysiloxane (B) is 3 parts by weight to 10 parts by weight.