Optical semiconductor device having pre-molded leadframe with window and method therefor

• US 9,397,236 B2
• Filed: 09/09/2013
• Issued: 07/19/2016
• Est. Priority Date: 03/07/2008
• Status: Active Grant

• Current Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Original Assignee: Stats Chippac Pte. Ltd. (JCET Group Co., Ltd.)
• Inventors: Camacho, Zigmund R., Bathan, Henry D., Tay, Lionel Chien Hui, Trasporto, Arnel Senosa
• Primary Examiner(s): Islam, Mohammad
• Assistant Examiner(s): SINGAL, ANKUSH K
• Application Number:
  US14/021,208
• Publication Number:
  US 20140011315A1
• Time in Patent Office: 1,044 Days
• Field of Search: 438/127
• US Class Current: 1/1
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15151 : the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A semiconductor device is made by providing a semiconductor die having an optically active area, providing a leadframe or pre-molded laminated substrate having a plurality of contact pads and a light transmitting material disposed between the contact pads, attaching the semiconductor die to the leadframe so that the optically active area is aligned with the light transmitting material to provide a light transmission path to the optically active area, and disposing an underfill material between the semiconductor die and leadframe. The light transmitting material includes an elevated area to prevent the underfill material from blocking the light transmission path. The elevated area includes a dam surrounding the light transmission path, an adhesive ring, or the light transmission path itself can be the elevated area. An adhesive ring can be disposed on the dam. A filler material can be disposed between the light transmitting material and contact pads.

Claims

1. A method of making a semiconductor device, comprising:

providing a semiconductor die including an optically active area;

providing a substrate including a contact pad extending from a first surface of the substrate through an opaque perimeter region of the substrate to a second surface of the substrate opposite the first surface of the substrate;

disposing a light transmitting material within an interior portion of the substrate to create a light transmitting region;

disposing the semiconductor die over the substrate to align the light transmitting region with the optically active area; and

depositing an encapsulant over the semiconductor die and substrate, wherein an elevated area of the substrate blocks the encapsulant to maintain light transmission through the light transmitting region to the optically active area of the semiconductor die.

2. The method of claim 1, wherein the elevated area of the substrate includes a dam to block the encapsulant.

3. The method of claim 1, further including disposing the elevated area of the substrate over the optically active area of the semiconductor die.

4. The method of claim 1, further including disposing an optical grade material between the light transmitting region of the substrate and the optically active area of the semiconductor die.

5. The method of claim 1, further including disposing an underfill material around the light transmitting region.

6. The method of claim 1, further including forming a notch in the light transmitting region.

7. A method of making a semiconductor device, comprising:

providing a semiconductor die including an optically active area;

providing a substrate including a contact pad extending from a first surface of the substrate through the substrate to a second surface of the substrate opposite the first surface of the substrate;

disposing a light transmitting material within an interior portion of the substrate to create a light transmitting region;

disposing the semiconductor die over the substrate to align the light transmitting region of the substrate with the optically active area of the semiconductor die;

depositing an encapsulant over the semiconductor die and substrate; and

depositing the encapsulant over the semiconductor die and substrate while an elevated area of the substrate blocks the encapsulant to maintain light transmission through the light transmitting region to the optically active area of the semiconductor die.

8. The method of claim 7, wherein the elevated area of the substrate includes a dam to block the encapsulant.

9. The method of claim 7, further including disposing the elevated area of the substrate over the optically active area of the semiconductor die.

10. The method of claim 7, further including depositing an underfill material around the light transmitting region.

11. The method of claim 7, further including disposing an opaque material around the light transmitting region of the substrate.

12. The method of claim 7, wherein the contact pad includes a finger extending from a dam bar for electrical connection to the semiconductor die.

13. A method of making a semiconductor device, comprising:

providing a semiconductor die;

providing a substrate including an elevated area of the substrate to block the encapsulant and a light transmitting region and a contact pad extending through the substrate between a first surface of the substrate and a second surface of the substrate opposite the first surface;

disposing the semiconductor die over the substrate; and

depositing an encapsulant over the semiconductor die and substrate.

14. The method of claim 13, wherein providing the elevated area of the substrate includes forming a dam around the light transmitting region of the substrate.

15. The method of claim 13, wherein providing the elevated area of the substrate includes depositing an underfill material around the light transmitting region of the substrate.

16. The method of claim 13, further including depositing an optical grade material between the semiconductor die and substrate.