Releasing apparatus for separating a semiconductor substrate from a semiconductor template

• US 9,397,250 B2
• Filed: 05/03/2012
• Issued: 07/19/2016
• Est. Priority Date: 10/09/2006
• Status: Active Grant

• Current Assignee: Ob Realty, LLC
• Original Assignee: Solexel, Inc.
• Inventors: Moslehi, Mehrdad M., Wang, David Xuan-Qi, Tor, Sam Tone, Kramer, Karl-Josef
• Primary Examiner(s): Bachner, Robert
• Application Number:
  US13/463,757
• Publication Number:
  US 20120272490A1
• Time in Patent Office: 1,538 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/76259 with separation/delamination along a porous layer
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: Y10T 279/11 Vacuum
• CPC Class Codes: Y10T 29/53683 Spreading parts apart or separating them from face to face engagement

Abstract

According to one embodiment, a releasing apparatus for separating a semiconductor substrate from a semiconductor template, the releasing apparatus having an enclosed pressure chamber having at least one gas inlet and at least one gas outlet. A top vacuum chuck for securing a released semiconductor substrate or semiconductor template in the enclosed pressure chamber. A bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in the enclosed pressure chamber. A gap between the attached semiconductor substrate and semiconductor template and the top vacuum chuck allowing gas flowing through the gap to generate lifting forces on the attached semiconductor substrate and semiconductor template.

Claims

1. A releasing apparatus for separating a semiconductor substrate from a semiconductor template, comprising:

an enclosed pressure chamber having at least one gas inlet and at least one gas outlet;

a top vacuum chuck for securing a released semiconductor substrate or semiconductor template in said enclosed pressure chamber;

a bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in said enclosed pressure chamber; and

a gap between said attached semiconductor substrate and semiconductor template and said top vacuum chuck allowing gas flowing through said gap to generate lifting forces on said attached semiconductor substrate and semiconductor template.

2. The releasing apparatus of claim 1, further comprising a position and motion control mechanism for controlling said gap size.

3. The releasing apparatus of claim 2, wherein said position and motion control mechanism is an actuator.

4. The releasing apparatus of claim 3, wherein said actuator controls said gap size at a continuous displacement.

5. The releasing apparatus of claim 3, wherein said actuator controls said gap size at a cycling displacement.

6. The releasing apparatus of claim 3, wherein said actuator is feed-back controlled from sensors for physical quantities such as air pressure or air flow or pulling force.

7. The releasing apparatus of claim 3, wherein said actuator controls said gap size at a pulsing displacement.

8. The releasing apparatus of claim 1, wherein said enclosed pressure chamber further comprises a top plate.

9. The releasing apparatus of claim 8, wherein said top plate has at least one of said at least one gas inlet and at least one gas outlet.

10. The releasing apparatus of claim 9, wherein said gas inlet or outlet on said top plate is positioned in the center of said top plate and connected to a gas flow control unit.

11. The releasing apparatus of claim 9, wherein said top plate has a plurality of air inlets or outlets with common or independent air flow controls.

12. The releasing apparatus of claim 1, wherein said enclosed pressure chamber further comprises a bottom plate.

13. The releasing apparatus of claim 12, wherein said bottom plate has at least one of said at least one gas inlet and at least one gas outlet.

14. The releasing apparatus of claim 13, wherein said air inlet or outlet on said bottom plate is positioned in the center of said bottom plate and connected to a gas flow control unit.

15. The releasing apparatus of claim 13, wherein said bottom plate has a plurality of air inlets or outlets with common or independent air flow controls.

16. The releasing apparatus of claim 12, further comprising at least one pillar mounting said bottom vacuum chuck to said bottom plate.

17. The releasing apparatus of claim 16, wherein said at least one pillar has through holes for vacuum connections to said bottom vacuum chuck.

18. The releasing apparatus of claim 12, further comprising pillars mounting said bottom vacuum chuck to said bottom plate.

19. The releasing apparatus of claim 16, wherein said pillars have through holes for vacuum connections to said bottom vacuum chuck.

20. A releasing apparatus for separating a semiconductor substrate from a semiconductor template, comprising:

an enclosed pressure chamber having at least one gas inlet and at least one gas outlet, said enclosed pressure chamber having at least a top plate, a bottom plate, and chamber sidewalls;

said top plate having at least a top vacuum chuck for securing a released semiconductor substrate or semiconductor template in said enclosed pressure chamber;

a bottom vacuum chuck for securing an attached semiconductor substrate and semiconductor template in said enclosed pressure chamber, said bottom vacuum chuck mounted on said bottom plate by pillars;

said pillars having through holes for vacuum connections to said bottom vacuum chuck;

a gap between said attached semiconductor substrate and semiconductor template and said top vacuum chuck allowing gas flowing through said gap to generate lifting forces on said attached semiconductor substrate and semiconductor template; and

a position and motion control mechanism in said chamber sidewalls for controlling said gap size.