Near field communication module

• US 9,397,386 B2
• Filed: 04/24/2014
• Issued: 07/19/2016
• Est. Priority Date: 04/29/2013
• Status: Active Grant

• Current Assignee: ASUSTek Computer, Inc.
• Original Assignee: ASUSTek Computer, Inc.
• Inventors: Lin, Kai-Min, Chen, Si-Hua
• Primary Examiner(s): PHAN, THO GIA
• Application Number:
  US14/260,285
• Publication Number:
  US 20140320353A1
• Time in Patent Office: 817 Days
• Field of Search: 343/702, 343/893, 455/89, 455/90
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/00 Antenna arrays or systems arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system H01Q3/00
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop

Abstract

A near field communication module applied to an electronic device is provided. The near field communication module includes a flexible circuit board, a first sensing antenna and a second sensing antenna. The flexible circuit board includes a first part and a second part connected with each other. The first sensing antenna is disposed at the first part. The second sensing antenna is disposed at the second part. The first sensing antenna is connected to the second sensing antenna. After the flexible circuit board is bended, it is disposed at a side of the electronic device.

Claims

1. A near field communication module, applied to an electronic device comprising:

a flexible circuit board including a first part and a second part connected to each other;

a first sensing antenna disposed at the flexible circuit board and located at the first part; and

a second sensing antenna disposed at the flexible circuit board and located at the second part, wherein the first sensing antenna is connected to the second sensing antenna and the first sensing antenna is disposed to overlap with the second sensing antenna, after the flexible circuit board is bended, the flexible circuit board is disposed on a side of the electronic device.

2. The near field communication module according to claim 1, wherein the electronic device includes:

a first housing; and

a second housing electrically connected to the first housing, wherein the near field communication module is disposed at one of the first housing and the second housing.

3. The near field communication module according to claim 2, wherein the first housing includes a first surface and a second surface opposite to each other, the first sensing antenna is located at the second surface of the first housing, and the second sensing antenna is located at the first surface of the first housing.

4. The near field communication module according to claim 2, wherein the second housing includes a third surface and a fourth surface opposite to each other, the first sensing antenna is located at the third surface of the second housing, and the second sensing antenna is located at the fourth surface of the second housing.

5. The near field communication module according to claim 2, further comprising:

a sheet disposed at a surface of the flexible circuit board, wherein the sheet, and the first sensing antenna and the second sensing antenna are located at opposite sides of the flexible circuit board, after the flexible circuit board is bended, the flexible circuit board is disposed on the side of the first housing or the second housing via the sheet.

6. The near field communication module according to claim 2, wherein the flexible circuit board further includes a third part, the third part is connected to the first part and the second part, after the flexible circuit board is bended, the third part is located at a side wall of the first housing or the second housing.

7. The near field communication module according to claim 6, further comprising:

a connecting wire, wherein the connecting wire crosses the third part and is connected between the first sensing antenna and the second sensing antenna.

8. The near field communication module according to claim 7, further comprising:

a first bridge wire, wherein the first bridge wire bridges over a part of the first sensing antenna and is connected between the connecting wire and the first sensing antenna; and

a second bridge wire, wherein the second bridge wire bridges over a part of the second sensing antenna and is connected between the connecting wire and the second sensing antenna.

9. The near field communication module according to claim 6, further comprising:

a third sensing antenna, wherein the third sensing antenna is disposed at the flexible circuit board and located at the third part, the third sensing antenna is connected to the first sensing antenna and the second sensing antenna, respectively, after the flexible circuit board is bended, the third sensing antenna is located at the side wall of the first housing or the second housing.

10. The near field communication module according to claim 9, further comprising:

a first bridge wire, wherein the first bridge wire bridges over a part of the first sensing antenna and a part of the third sensing antenna, and the first bridge wire is connected between the third sensing antenna and first sensing antenna; and

a second bridge wire, wherein the second bridge wire bridges over a part of the second sensing antenna and connected between the connecting wire and the second sensing antenna.

11. The near field communication module according to claim 1, wherein the area of the first part of the flexible circuit board is larger than or equal to the area of the second part.