Through chip coupling for signal transport
First Claim
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1. A method of transmitting a signal from an amplifier circuit to an antenna utilizing through-chip coupling, the method comprising:
- at a first coil on a first integrated circuit (IC) chip of a three-dimensional (3D) IC package, receiving a transmission signal from a processing circuit;
wirelessly communicating the transmission signal from the first coil to a second coil on a second IC chip of the 3D IC package, wherein the first coil and the second coil are not in direct contact and wherein the first coil and the second coil vertically overlap, and wherein the first IC chip and the second IC chip form the 3D IC package; and
communicating the transmission signal from the second coil to an antenna on the second IC chip.
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Abstract
Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.
31 Citations
22 Claims
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1. A method of transmitting a signal from an amplifier circuit to an antenna utilizing through-chip coupling, the method comprising:
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at a first coil on a first integrated circuit (IC) chip of a three-dimensional (3D) IC package, receiving a transmission signal from a processing circuit; wirelessly communicating the transmission signal from the first coil to a second coil on a second IC chip of the 3D IC package, wherein the first coil and the second coil are not in direct contact and wherein the first coil and the second coil vertically overlap, and wherein the first IC chip and the second IC chip form the 3D IC package; and communicating the transmission signal from the second coil to an antenna on the second IC chip. - View Dependent Claims (2, 3, 4)
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5. A method of receiving a signal from an antenna at an amplifier circuit utilizing through-chip coupling, the method comprising:
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at a first coil on a first integrated circuit (IC) chip of a three-dimensional (3D) IC package, receiving a reception signal from an antenna; wirelessly communicating the reception signal from the first coil to a second coil on a second IC chip of the 3D IC package, wherein the first coil and the second coil are not in direct contact, and wherein the first coil and the second coil vertically overlap, and wherein the first IC chip and the second IC chip are bonded to form the 3D IC package; and communicating the reception signal to a processing circuit on the second IC chip. - View Dependent Claims (6, 7, 8)
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9. An interface for through-chip coupling of an antenna and an analog amplifier circuit, the interface comprising:
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a first coil on a first integrated circuit (IC) chip, wherein the first coil is coupled to an antenna; and a second coil on a second IC chip, wherein the second coil is not in direct contact with the first coil, wherein the second coil is coupled to a first amplifier circuit, and wherein the first coil and the second coil are wirelessly communicable with each other to communicatively transmit signals between the antenna and the first amplifier circuit, wherein the first coil and the second coil vertically overlap, and wherein the first chip and the second chip define a three-dimensional (3D) IC package, and wherein the first IC chip and the second IC chip are bonded to form the 3D IC package. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification