Electrically conductive adhesive compound and adhesive tape

• US 9,399,723 B2
• Filed: 07/10/2012
• Issued: 07/26/2016
• Est. Priority Date: 08/10/2011
• Status: Active Grant

• Current Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Original Assignee: Tesa SE (maxingvest GmbH & Co. KGaA)
• Inventors: Keite-Telgenbscher, Klaus
• Primary Examiner(s): LEE, DANIEL H.
• Application Number:
  US14/236,249
• Publication Number:
  US 20140216654A1
• Time in Patent Office: 1,477 Days
• Field of Search: 156/325
• US Class Current: 1/1
• CPC Class Codes: C08F 220/06 Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
• CPC Class Codes: C08F 220/1804 C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
• CPC Class Codes: C08F 220/1808 C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 7/06 Elements
• CPC Class Codes: C09J 11/04 inorganic
• CPC Class Codes: C09J 133/08 Homopolymers or copolymers of acrylic acid esters
• CPC Class Codes: C09J 2203/326 for bonding electronic components such as wafers, chips or semiconductors
• CPC Class Codes: C09J 2301/302 the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
• CPC Class Codes: C09J 2301/314 the adhesive layer and/or the carrier being conductive
• CPC Class Codes: C09J 2301/408 additives as essential feature of the adhesive layer
• CPC Class Codes: C09J 2421/00 Presence of unspecified rubber
• CPC Class Codes: C09J 2433/00 Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 7/10 without carriers
• CPC Class Codes: C09J 7/38 Pressure-sensitive adhesives [PSA]
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29347 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/29499 Shape or distribution of the fillers
• CPC Class Codes: H01L 2224/83815 : Reflow soldering
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/83905 : Combinations of bonding methods provided for in at least two different groups from H01L2224/838 - H01L2224/83904
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 428/2857 : including metal or compound thereof or natural rubber

Abstract

A pressure-sensitive adhesive composition comprising a) a polymer-metal blend comprising at least one pressure-sensitive adhesive and at least one metal component melting in the temperature range from 50° C. to 400° C., and b) at least one fibrous, electrically conductive filler, the filler being present at least partly in the form of a bound fiber network with the metal component.

Claims

1. A pressure-sensitive adhesive composition comprising

a) a polymer-metal blend comprising

at least one pressure-sensitive adhesive, and

at least one metal component melting in a temperature range from 50°

C. to 400°

C., and

b) at least one fibrous, electrically conductive filler, wherein the filler is present, at least partly, in a form of a bound fiber network with the at least one metal component.

2. The pressure-sensitive adhesive composition according to claim 1, wherein the at least one metal component is a metal or a metal alloy.

3. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive is a pressure-sensitive polyacrylate adhesive.

4. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive is a pressure-sensitive rubber adhesive.

5. The pressure-sensitive adhesive composition according to claim 1, wherein at least one of the at least one fibrous, electrically conductive filler is metallic.

6. The pressure-sensitive adhesive composition according to claim 1, wherein at least one of the at least one fibrous, electrically conductive filler is a carbon modification or a carbon-containing chemical compound.

7. The pressure-sensitive adhesive composition according to claim 1, wherein at least one of the at least one fibrous, electrically conductive filler is magnetic.

8. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive has a layer thickness of 50 μ

m and a water vapor permeation of less than 50 g/m²d at 38°

C. and 50% relative humidity.

9. The pressure-sensitive adhesive composition according to claim 1, wherein the pressure-sensitive adhesive has a water content of less than 5000 ppm determined after 72 h of conditioning at 23°

C. and 50% relative humidity by means of Karl Fischer titration.

10. The pressure-sensitive adhesive composition according to claim 9, wherein the pressure-sensitive adhesive has a water content of less than 1000 ppm determined after 72 h of conditioning at 23°

C. and 50% relative humidity by means of Karl Fischer titration.

11. A pressure-sensitive adhesive tape comprising at least one layer of the pressure-sensitive adhesive composition according to claim 1.

12. The pressure-sensitive adhesive tape according to claim 11, further comprising a layer of a carrier material.

13. The pressure-sensitive adhesive tape according to claim 11, wherein the layer of a carrier material comprises an electrically conductive carrier material.

14. A method for adhesive bonding on a first substrate surface, the method comprising:

bonding the first substrate surface with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11.

15. The method according to claim 14, further comprising bonding the first substrate surface to a second substrate surface, at a bond site, with the pressure-sensitive adhesive composition according to claim 1 or the pressure-sensitive adhesive tape according to claim 11.

16. The method according to claim 15, further comprising:

heating the bond site, during or after the bonding operation, to a temperature above the melting temperature of the at least one metal component.