High performance stress-enhanced MOSFETs using Si:C and SiGe epitaxial source/drain and method of manufacture
First Claim
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1. A method of forming a semiconductor device, the method comprising:
- forming a field effect transistor structure on a substrate;
forming spacers on respective sidewalls of the field effect transistor structure;
forming a protection layer over a top surface of the field effect transistor structure, after forming the spacers;
removing the protection layer from over the top surface of the field effect transistor structure;
forming a stressing layer on the substrate, the stressing layer comprising a first lattice constant different from a second lattice constant of the substrate;
doping the stressing layer with dopants; and
forming a silicide layer on the stressing layer.
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Abstract
Methods of forming a semiconductor device are provided. A method of forming a semiconductor device may include forming a stressing layer on a substrate. The method may include doping the stressing layer with dopants. The method may include forming a silicide layer on the stressing layer. Moreover, the stressing layer may include a first lattice constant different from a second lattice constant of the substrate.
131 Citations
18 Claims
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1. A method of forming a semiconductor device, the method comprising:
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forming a field effect transistor structure on a substrate; forming spacers on respective sidewalls of the field effect transistor structure; forming a protection layer over a top surface of the field effect transistor structure, after forming the spacers; removing the protection layer from over the top surface of the field effect transistor structure; forming a stressing layer on the substrate, the stressing layer comprising a first lattice constant different from a second lattice constant of the substrate; doping the stressing layer with dopants; and forming a silicide layer on the stressing layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a semiconductor device, the method comprising:
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forming a pFET stack and a nFET stack on a substrate; forming spacers on respective sidewalls of the pFET stack and the nFET stack; forming a protection layer over respective top surfaces of the pFET stack and the nFET stack, and over the spacers; forming a first stressing layer adjacent the pFET stack, the first stressing layer comprising a first lattice constant larger than a second lattice constant of the substrate; forming a second stressing layer adjacent the nFET stack; doping the first stressing layer with p-type dopants; doping the second stressing layer with n-type dopants; and forming silicide layers on each of the first and second stressing layers. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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16. A method of forming a semiconductor device, the method comprising:
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forming a pFET stack and a nFET stack on a substrate; forming a first stressing layer adjacent the pFET stack, the first stressing layer comprising a first lattice constant larger than a second lattice constant of the substrate, wherein forming the first stressing layer comprises; forming a first mask on the nFET stack and exposing the pFET stack; etching the substrate, while the first mask is on the nFET stack, to form a trench at opposing sides of the pFET stack; and selectively growing the first stressing layer within the trench; forming a second stressing layer adjacent the nFET stack; doping the first stressing layer with p-type dopants; doping the second stressing layer with n-type dopants; and forming silicide layers on each of the first and second stressing layers. - View Dependent Claims (17, 18)
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Specification