Light emitting device package having a package body including a recess and lighting system including the same

• US 9,401,467 B2
• Filed: 04/27/2010
• Issued: 07/26/2016
• Est. Priority Date: 04/28/2009
• Status: Active Grant

• Current Assignee: Suzhou Lekin Semiconductor Company Limited
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Jo, Kyoung Woo
• Primary Examiner(s): Jackson, Jr., Jerome
• Assistant Examiner(s): CHEN, DAVID Z
• Application Number:
  US12/768,184
• Publication Number:
  US 20100270579A1
• Time in Patent Office: 2,282 Days
• Field of Search: 257/98, 257/99, 257/100
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body. The LED package has a structure in which the LED chip may be buried into a recess formed on a planar surface on the upper portion of the package body such that a bottom surface of the recess lies below the planar surface. Thus, a main path through which heat generated from the LED chip is transmitted may be expanded from a bottom surface of the LED chip up to a lateral surface thereof to widen a dissipation area, thereby improving thermal emission efficiency.

Claims

1. A light emitting device (LED) package comprising:

a package body having a planar surface and a recess, wherein a bottom surface of the recess is lower than the planar surface;

an LED chip comprising a substrate and a light emitting structure; and

an electrode provided on the package body,

wherein the substrate of the LED chip comprises a bottom surface and an upper surface,

wherein the light emitting structure comprises a first conductive type semiconductor layer on the upper surface of the substrate, an active layer on the first conductive type semiconductor layer and a second conductive type semiconductor layer on the active layer,

wherein the active layer is positioned above the planar surface of the package body,

wherein the bottom surface of the substrate is formed of the same material as the upper surface of the substrate,

wherein a lateral width of the light emitting structure is substantially the same as a lateral width of the upper surface of the substrate,

wherein a lateral width of the package body is greater than a lateral width of the substrate of the LED chip,

wherein the electrode is directly disposed on a bottom surface of the package body,

wherein the substrate of the LED chip comprises a conductive substrate,

wherein an upper portion of the package body comprises a conductive package body,

wherein a top surface of the conductive substrate of the LED chip is positioned above the planar surface of the package body,

wherein a bottom surface of the light emitting structure is positioned above the planar surface of the package body,

wherein the substrate of the LED chip further comprises an inclined side surface and a vertical side surface,

wherein the inclined side surface of the substrate is formed of the same material as the upper surface,

wherein the inclined side surface is disposed in the recess, and

wherein the entire vertical side surface is disposed above the planar surface.

2. The LED package of claim 1, wherein the vertical side surface is a first section perpendicular to the bottom surface of the substrate of the LED chip and wherein the inclined side surface is a second section, the second section having an inclined angle to the bottom surface of the substrate of the LED chip.

3. The LED package of claim 2, wherein a side surface of the recess includes an inclined angle which is substantially same as the inclined angle of the second section.

4. The LED package of claim 1, further comprising a solder between the LED chip and the recess of the package body.

5. The LED package of claim 1, wherein the substrate of the LED chip includes a contour corresponding to a contour of the recess.

6. The LED package of claim 1, wherein the electrode includes

a first electrode electrically connecting to the bottom surface of the substrate;

and

a second electrode electrically connecting to a top surface of the light emitting structure by a wire.

7. The LED package of claim 2, wherein the first section has a height of less than about 100 μ

m.

8. A lighting system comprising a light emitting module comprising the LED package of claim 1.

9. The LED package of claim 1, wherein the upper portion of the package body comprises the planar surface and the recess, and

the LED chip is provided in the recess of the upper portion of the package body.

10. The LED package of claim 1, wherein the lateral width of the package body is greater than a greatest lateral width of the substrate of the LED chip.

11. The LED package of claim 1,

wherein a lateral width of the electrode is greater than a lateral width of the conductive package body.

12. A light emitting device (LED) package comprising:

a package body having a planar surface and a recess, wherein a bottom surface of the recess is lower than the planar surface;

an electrode provided on the package body; and

an LED chip comprising a substrate and a light emitting structure,

wherein the light emitting structure comprises a first conductive type semiconductor layer on an upper surface of the substrate, an active layer on the first conductive type semiconductor layer and a second conductive type semiconductor layer on the active layer,

wherein the LED chip is provided in the recess such that a bottom surface of the LED chip is below the planar surface of the package body,

wherein the substrate of the LED chip comprises a bottom surface, the upper surface, an inclined side surface and a vertical side surface;

wherein the bottom surface of the substrate is formed of the same material as the upper surface of the substrate,

wherein the electrode is directly disposed on a bottom surface of the package body,

wherein the light emitting structure is directly disposed on the upper surface of the substrate of the LED chip,

wherein the substrate of the LED chip comprises a conductive substrate,

wherein an upper portion of the package body comprises a conductive package body,

wherein a top surface of the conductive substrate of the LED chip is positioned above the planar surface of the package body,

wherein a bottom surface of the light emitting structure is positioned above the planar surface of the package body,

wherein the inclined side surface is disposed in the recess,

wherein the entire vertical side surface is disposed above the planar surface, and wherein a lateral width of the light emitting structure is substantially the same as a lateral width of the upper surface of the substrate.

13. The LED package of claim 12, wherein the upper portion of the package body comprises the planar surface and the recess, and

the LED chip is provided in the recess of the upper portion of the package body.

14. The LED package of claim 12, wherein a vertical height of the inclined side surface is greater than a height of the vertical side surface.

15. A light emitting device (LED) package comprising:

a package body having a planar surface and a recess, wherein a bottom surface of the recess is lower than the planar surface;

an electrode provided on the package body; and

an LED chip comprising a substrate and a light emitting structure,

wherein the light emitting structure comprises a first conductive type semiconductor layer on an upper surface of the substrate of the LED chip, an active layer on the first conductive type semiconductor layer and a second conductive type semiconductor layer on the active layer,

wherein the LED chip is provided in the recess such that a bottom surface of the LED chip is below the planar surface of the package body,

wherein the substrate of the LED chip comprises the bottom surface, the upper surface, an inclined side surface and a vertical side surface,

wherein a vertical height of the inclined side surface is greater than a height of the vertical side surface,

wherein the bottom surface of the substrate is disposed on the bottom surface of the recess,

wherein the substrate of the LED chip comprises a conductive substrate,

wherein an upper portion of the package body comprises a conductive package body,

wherein the electrode is directly disposed on a bottom surface of the package body, and

wherein a top surface of the conductive substrate of the LED chip is positioned above the planar surface of the package body,

wherein a bottom surface of the light emitting structure is positioned above the planar surface of the package body,

wherein the inclined side surface is disposed in the recess, and

wherein the entire vertical side surface is disposed above the planar surface.

16. The LED package of claim 15, wherein the upper portion of the package body comprises the planar surface and the recess, and the LED chip is provided in the recess of the upper portion of the package body.