MEMS device and method of manufacturing a MEMS device

• US 9,402,138 B2
• Filed: 10/12/2012
• Issued: 07/26/2016
• Est. Priority Date: 10/12/2012
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Dehe, Alfons, Pindl, Stephan, Knott, Bernhard, Ahrens, Carsten
• Primary Examiner(s): Vu, David
• Assistant Examiner(s): INOUSSA, MOULOUCOULAY
• Application Number:
  US13/651,372
• Publication Number:
  US 20140103460A1
• Time in Patent Office: 1,383 Days
• Field of Search: 257/415, 257/E29.324, 257/E21.04, 257/416, 257/E29, 257/E21, 438/694, 438/52, 438/14, 438/53, 438/51
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81C 1/00825 Protect against mechanical threats, e.g. against shocks, or residues B81C1/00261 take precedence
• CPC Class Codes: B81C 1/00873 characterised by special arrangements of the devices, allowing an easier separation
• CPC Class Codes: B81C 2201/017 Methods for controlling internal stress of deposited layers not provided for in B81C2201/0164 - B81C2201/0169
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

Claims

1. A MEMS device comprising:

a polymer layer;

a substrate disposed on the polymer layer;

a MEMS stack disposed on the substrate;

a first through opening having a first width and disposed in the polymer layer;

a second through opening having a second width and disposed in the substrate such that the second through opening abuts the MEMS stack and the first through opening, wherein a major surface of the polymer layer comprises a contact area for mounting the MEMS device; and

a third through opening comprising an empty space disposed in the polymer layer, wherein the first through opening is laterally separated from the third through opening by a region of the polymer layer, wherein the polymer layer, the substrate, the MEMS stack, the first through opening, the second through opening, and the third through opening are part of the MEMS device that is configured to be operational.

2. The MEMS device according to claim 1, wherein the second through opening is larger than the first through opening.

3. The MEMS device according to claim 1, wherein the first through opening is disposed inside the third through opening.

4. The MEMS device according to claim 1, wherein the MEMS device further comprises a hard mask layer disposed between the substrate and the polymer layer.

5. The MEMS device according to claim 1, wherein the MEMS stack comprises a backplate and a membrane.

6. The MEMS device according to claim 5, wherein the membrane is closer to the substrate than the backplate.

7. The MEMS device according to claim 5, wherein the backplate is closer to the substrate than the membrane.

8. The MEMS device according to claim 1, wherein the substrate comprises a pre-amplifier and input/output pads.

19. The MEMS device according to claim 1, wherein an opening width of the third through opening is narrower than the first width.

9. A module comprising:

a MEMS device carrier; and

a MEMS device comprising;

a polymer layer, wherein a major surface of the polymer layer comprises a contact area for mounting the MEMS device;

a substrate disposed on the polymer layer;

a mask layer disposed between the substrate and the polymer layer;

a MEMS stack disposed on the substrate;

an opening through the polymer layer and the substrate connecting the MEMS stack, wherein the MEMS device is mounted on the MEMS carrier device at the contact area of the polymer layer, and

a ring opening comprising a ring shaped opening having an opening width narrower than an opening width of the opening disposed in the polymer layer, the ring shaped opening surrounding the opening through the polymer layer, wherein the ring shaped opening exposes a region of the mask layer and comprises empty space.

10. The module according to claim 9, wherein the substrate comprises a thickness of 100 μ

m to 200 μ

m.

11. The module according to claim 10, wherein the polymer layer comprises a thickness of 100 μ

m to 200 μ

m.

18. The module according to claim 10, further comprising an adhesive connecting the MEMS device carrier and the MEMS device.

20. The module according to claim 9, wherein the opening comprises a first portion in the polymer layer and second portion in the substrate, wherein the first portion has a first width and the second portion has a second width.

21. The module according to claim 20, wherein the first width is the same as the second width.

22. The module according to claim 20, wherein the first width is greater than the second width.

23. The module according to claim 9, wherein the MEMS stack comprises a back plate and a membrane.

24. The module according to claim 23, wherein the membrane is disposed between the substrate and the back plate.

25. The module according to claim 23, wherein the back plate is disposed between the substrate and the membrane.

26. The module according to claim 9, wherein the substrate comprises a pre-amplifier and input/output pads.

12. A MEMS device comprising:

a polymer layer, wherein a major surface of the polymer layer comprises a contact area for mounting the MEMS device;

a substrate disposed on the polymer layer, the substrate comprising a thickness of 100 μ

m to 200 μ

m, the polymer layer comprising a thickness of 100 μ

m to 200 μ

m;

a MEMS stack disposed on the substrate, the MEMS stack comprising a thickness of 100 μ

m to 200 μ

m; and

a first through opening disposed in the polymer layer and the substrate, the first through opening exposing the MEMS stack; and

a second through opening comprising an empty space disposed in the polymer layer, the second through opening disposed around the first through opening, wherein the polymer layer, the substrate, the MEMS stack, the first through opening, and the second through opening are part of the MEMS device that is configured to be operational.

13. The MEMS device according to claim 12, wherein the polymer layer is a negative photoresist layer.

14. The MEMS device according to claim 12, wherein the polymer layer is a positive photoresist layer.

15. The MEMS device according to claim 12, further comprising a hard mask layer disposed between the substrate and the polymer layer.

16. The MEMS device according to claim 12, wherein the second through opening comprises a ring trench disposed around the first through opening.

17. The MEMS device according to claim 16, wherein the first through opening comprises a smaller diameter than the ring trench.