Metal-free monolithic epitaxial graphene-on-diamond PWB with optical waveguide

• US 9,402,322 B1
• Filed: 03/04/2015
• Issued: 07/26/2016
• Est. Priority Date: 03/04/2015
• Status: Expired due to Fees

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Inventors: Findley, David G.
• Primary Examiner(s): Vargot, Mathieu
• Application Number:
  US14/638,686
• Time in Patent Office: 510 Days
• US Class Current: 1/1
• CPC Class Codes: B28B 1/001 Rapid manufacturing of 3D objects by additive depositing, agglomerating or laminating of material selective deposition modelling of metallic powder B22F10/00; rapid manufacturing of 3D objects in general and in particular of plastics B29C64/00
• CPC Class Codes: B29C 64/165 using a combination of solid and fluid materials, e.g. a powder selectively bound by a liquid binder, catalyst, inhibitor or energy absorber
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: C04B 2235/3826 Silicon carbides
• CPC Class Codes: C04B 2235/404 Refractory metals
• CPC Class Codes: C04B 2235/427 Diamond
• CPC Class Codes: C04B 2235/48 Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
• CPC Class Codes: C04B 2235/483 Si-containing organic compounds, e.g. silicone resins, (poly)silanes, (poly)siloxanes or (poly)silazanes
• CPC Class Codes: C04B 2235/5288 Carbon nanotubes
• CPC Class Codes: C04B 2235/5292 Flakes, platelets or plates
• CPC Class Codes: C04B 2235/5454 nanometer sized, i.e. below 100 nm
• CPC Class Codes: C04B 2235/6026 Computer aided shaping, e.g. rapid prototyping
• CPC Class Codes: C04B 2235/80 Phases present in the sintered or melt-cast ceramic products other than the main phase
• CPC Class Codes: C04B 2235/94 Products characterised by their shape
• CPC Class Codes: C04B 2237/363 Carbon
• CPC Class Codes: C04B 2237/365 Silicon carbide
• CPC Class Codes: C04B 2237/68 Forming laminates or joining articles wherein at least one substrate contains at least two different parts of macro-size, e.g. one ceramic substrate layer containing an embedded conductor or electrode
• CPC Class Codes: C04B 35/522 Graphite C04B35/536 takes precedence
• CPC Class Codes: C04B 35/524 : obtained from polymer precursors, e.g. glass-like carbon material
• CPC Class Codes: C04B 35/532 : containing a carbonisable binder
• CPC Class Codes: C04B 35/5626 : based on tungsten carbides
• CPC Class Codes: C04B 35/565 : based on silicon carbide
• CPC Class Codes: C04B 35/571 : obtained from Si-containing polymer precursors or organosilicon monomers
• CPC Class Codes: C04B 35/583 : based on boron nitride
• CPC Class Codes: C04B 35/62645 : Thermal treatment of powders or mixtures thereof other than sintering
• CPC Class Codes: C04B 35/65 : Reaction sintering of free metal- or free silicon-containing compositions C04B35/573, C04B35/591 take precedence
• CPC Class Codes: C04B 35/80 : Fibres, filaments, whiskers, platelets, or the like
• CPC Class Codes: G02B 2006/12035 : Materials
• CPC Class Codes: G02B 2006/12135 : Temperature control
• CPC Class Codes: G02B 2006/1219 : Polymerisation
• CPC Class Codes: G02B 6/12002 : Three-dimensional structures
• CPC Class Codes: G02B 6/132 : by deposition of thin films
• CPC Class Codes: G02B 6/32 : having lens focusing means positioned between opposed fibre ends with lens being an integral part of the single fibre end G02B6/262
• CPC Class Codes: G02B 6/4204 : the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: H05K 1/0272 : Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 1/0274 : Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 2201/0323 : Carbon
• CPC Class Codes: H05K 2201/037 : Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
• CPC Class Codes: H05K 2201/064 : Fluid cooling, e.g. by integral pipes

Abstract

According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by thermolysis of layers of a preceramic polymer. A plurality of tubes are formed within the circuit board and comprise a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. The apparatus also includes a plurality of optical waveguides formed within the circuit board. Each optical waveguide comprises a core of polycrystalline silicon carbide surrounded by polycrystalline diamond. The polycrystalline diamond is formed by thermolysis of poly(hydridocarbyne) and the silicon carbide is formed by thermolysis of poly(methylsilyne).

Claims

1. A method for forming a waveguide comprising:

utilizing a three-dimensional (3D) printer to deposit a plurality of layers of poly(hydridocarbyne) and poly(methylsilyne), wherein;

the plurality of layers of poly(hydridocarbyne) are deposited in the geometry of a cladding for an optical waveguide; and

the plurality of layers of poly(methylsilyne) are deposited so as to form the shape of a core of the optical waveguide; and

heating the plurality of layers of poly(hydridocarbyne) and poly(methylsilyne) to a first temperature to form the optical waveguide, the optical waveguide being formed of a core of polycrystalline silicon carbide surrounded by polycrystalline diamond after the heating of the plurality of layers of poly(hydridocarbyne) and poly(methylsilyne).

2. The method of claim 1, further comprising depositing layers of poly(methylsilyne) at a termination of the optical waveguide in the geometry of a lens.

3. The method of claim 1, wherein the first temperature is greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius.

4. The method of claim 1, wherein the plurality of layers of poly(hydridocarbyne) and poly(methylsilyne) are heated to the first temperature within an inert atmosphere.