Superheat sensor having external temperature sensor

• US 9,404,815 B2
• Filed: 09/15/2015
• Issued: 08/02/2016
• Est. Priority Date: 03/16/2012
• Status: Active Grant

• Current Assignee: Zhejiang Dunan Hetian Metals Company Limited (Zhejiang Dun 'an Artificial Environment Co., Ltd)
• Original Assignee: Zhejiang Dunan Hetian Metals Company Limited (Zhejiang Dun 'an Artificial Environment Co., Ltd)
• Inventors: Long, Wayne C., Arunasalam, Parthiban
• Primary Examiner(s): KAPLAN VERBITSKY, GAIL
• Application Number:
  US14/854,449
• Publication Number:
  US 20160003691A1
• Time in Patent Office: 322 Days
• Field of Search: 374 10-102, 374/110, 374/112, 374/114, 374/115, 374/4, 374/5, 374/141, 374/142, 374/143, 374/163, 374/185, 374/183
• US Class Current: 1/1
• CPC Class Codes: G01K 13/02 for measuring temperature of moving fluids or granular materials capable of flow
• CPC Class Codes: G01K 13/026 of moving liquids
• CPC Class Codes: G01K 15/005 Calibration
• CPC Class Codes: G01K 2201/00 Application of thermometers in air-conditioning systems

Abstract

A superheat sensor includes a housing, a pressure sensor mounted within the housing, and a processor. A fluid passageway connects the pressure sensor to a source of superheat fluid. An external temperature sensor is located outside the housing of the superheat sensor and is electrically connected to the processor. The external temperature sensor is also electronically connected to a component of a fluid system to which the superheat sensor is attached and is configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.

Claims

1. A superheat sensor comprising:

a housing;

a pressure sensor mounted within the housing;

a fluid passageway connecting the pressure sensor to a source of superheat fluid;

a processor; and

an external temperature sensor located outside the housing of the superheat sensor and not in contact with the superheat fluid within the superheat sensor, the external temperature sensor electrically connected to the processor and electronically connected to a heat generating component of a fluid system to which the superheat sensor is attached and configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.

2. The superheat sensor according to claim 1, further including a fluid inlet member having the fluid passageway formed therethrough, the fluid inlet member selectively connectable to a plurality of fluid systems.

3. The superheat sensor according to claim 1, wherein the pressure sensor produces an electrical analogue of pressure.

4. The superheat sensor according to claim 3, wherein the pressure sensor is one of a silicon, piezo-ceramic, capacitive, and integrated hall-effect transducer.

5. The superheat sensor according to claim 2, further including a communication module attached to the housing and configured to transmit data to a target device to which the communication module is electrically connected.

6. The superheat sensor according to claim 1, wherein the external temperature sensor produces an electrical analogue of temperature.

7. The superheat sensor according to claim 6, wherein the temperature sensor is one of a thermistor, a thermocouple, a resistive element etched onto a substrate, and a diode.

8. The superheat sensor according to claim 1, further including an Input/Output module connected to the processor, wherein the processor processes input signals from the pressure sensor and the temperature sensor, detects a fluid type, calculates a superheat of the fluid, provides an output through the Input/Output module to a computer operatively connected to the Input/Output module, and wherein the output identifies the level of the calculated superheat, provides fluid temperature, provides fluid pressure, provides fluid type, and provides historical data maintained in an onboard memory.

9. The superheat sensor according to claim 1, further including an Input/Output (IO) module attached to the housing and configured to report data to a target device to which the IO module is electrically connected.

10. The superheat sensor according to claim 9, wherein the target device is one of a temperature sensor, a controller module, a computer, a cell phone, and a memory card.

11. A superheat sensor comprising:

a housing;

a pressure sensor mounted within the housing;

a fluid passageway connecting the pressure sensor to a source of superheat fluid;

a processor; and

an external temperature sensor located outside the housing of the superheat sensor and electrically connected to the processor, the external temperature sensor electronically connected to a heat generating component of the fluid system to which the superheat sensor is attached and configured to provide one of an internal temperature of the component, an external temperature of the component, and a temperature of fluid in the component.