Methodology and apparatus for testing conductive adhesive within antenna assembly
First Claim
1. A method for using a test system to characterize device structures under test, where the test system includes a test unit and a test fixture, the method comprising:
- activating pressure-sensitive adhesive material in the device structures under test by applying pressure to the adhesive material;
once the pressure-sensitive adhesive material has been activated, applying stress to the device structures under test with the test fixture; and
while the stress is applied to the device structures under test, gathering test data on the device structures under test with the test unit, wherein the gathered test data comprises radio-frequency scattering parameter measurements.
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Accused Products
Abstract
Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.
20 Citations
14 Claims
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1. A method for using a test system to characterize device structures under test, where the test system includes a test unit and a test fixture, the method comprising:
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activating pressure-sensitive adhesive material in the device structures under test by applying pressure to the adhesive material; once the pressure-sensitive adhesive material has been activated, applying stress to the device structures under test with the test fixture; and while the stress is applied to the device structures under test, gathering test data on the device structures under test with the test unit, wherein the gathered test data comprises radio-frequency scattering parameter measurements. - View Dependent Claims (2, 3)
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4. A method for using a test system to characterize device structures under test, wherein the test system includes a test unit and a test fixture and wherein the device structures under test include an adhesive material, the method comprising:
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with the test fixture, applying tensile stress to the device structures under test; while the tensile stress is applied to the device structures under test, gathering radio-frequency scattering parameter measurements on the device structures under test with the test unit; and with the test unit, determining whether the adhesive material exhibits any defects by analyzing the gathered radio-frequency scattering parameter measurements. - View Dependent Claims (5, 6, 7, 8, 9)
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10. A test system, comprising:
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a test fixture that is configured to receive device structures under test and that is configured to apply tensile stress on device structures under test while the device structures under test are received within the test fixture; a test unit configured to gather test data on the device structures under test; and a test probe that receives radio-frequency test signals from the test unit and that is coupled to the device structures under test. - View Dependent Claims (11, 12, 13, 14)
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Specification