Power supply arrangement for semiconductor device
First Claim
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1. A semiconductor device, comprising:
- a device die comprising a first circuit and a second circuit;
an interposer comprising a first surface, a second surface opposite to the first surface, and a plurality of through vias extending from the first surface to the second surface, the device die being attached to the first surface of the interposer;
a first power supply die attached to the second surface of the interposer, electrically coupled to the first circuit through the interposer, and configured to supply power for the first circuit; and
a second power supply die different from the first power supply die, the second power supply die attached to the second surface of the interposer, electrically coupled to the second circuit through the interposer, and configured to supply power for the second circuit,wherein the first and second power supply dies overlap the device die in a thickness direction of the device die.
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Abstract
A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.
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Citations
20 Claims
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1. A semiconductor device, comprising:
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a device die comprising a first circuit and a second circuit; an interposer comprising a first surface, a second surface opposite to the first surface, and a plurality of through vias extending from the first surface to the second surface, the device die being attached to the first surface of the interposer; a first power supply die attached to the second surface of the interposer, electrically coupled to the first circuit through the interposer, and configured to supply power for the first circuit; and a second power supply die different from the first power supply die, the second power supply die attached to the second surface of the interposer, electrically coupled to the second circuit through the interposer, and configured to supply power for the second circuit, wherein the first and second power supply dies overlap the device die in a thickness direction of the device die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device, comprising:
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a device die comprising a first circuit and a second circuit; a first power supply die electrically coupled to the first circuit and configured to supply power to the first circuit; a second power supply die electrically coupled to the second circuit and configured to supply power to the second circuit; and an interposer between the device die and the first power supply die and between the device die and the second power supply die; wherein, the first power supply die at least partially overlaps the first circuit and the second power supply die at least partially overlaps the second circuit. - View Dependent Claims (13, 14, 15, 16)
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17. A semiconductor device, comprising:
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an interposer comprising a first surface and a second surface; a device die comprising a first circuit and a second circuit, the first circuit and the second circuit being attached to the first surface of the interposer; a first power supply die attached to the second surface of the interposer and configured to supply power to the first circuit through the interposer; and a second power supply die attached to the second surface of the interposer and configured to supply power to the second circuit through the interposer. - View Dependent Claims (18, 19, 20)
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Specification