Package for high-power LED devices

• US 9,406,654 B2
• Filed: 01/27/2014
• Issued: 08/02/2016
• Est. Priority Date: 01/27/2014
• Status: Active Grant

• Current Assignee: Ledengin, Inc. (Ams-Osram AG)
• Original Assignee: Ledengin, Inc. (Ams-Osram AG)
• Inventors: Yan, Xiantao
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US14/165,372
• Publication Number:
  US 20150214194A1
• Time in Patent Office: 918 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

Packages for LED-based light devices include interface structures that can facilitate heat transfer from the package to a heat sink. The package can include multiple LEDs mounted on a ceramic substrate that provides electrically conductive pathways between the LEDs and metal contact pads at a peripheral region of a top surface of the substrate. A bottom surface of the substrate can be patterned with a plate, such as a thick supporting plate, made of metal and/or other materials with high thermal conductivity, that can be attached to an external heat sink.

Claims

1. A light device package comprising:

a substrate having a top surface that includes a recess region, the recess region having a plurality of LED contact pads disposed therein for connecting one or more light-emitting diodes (LEDs);

a thick supporting plate disposed over at least a portion of the bottom surface of the substrate; and

a plurality of peripheral contact pads disposed on an outer area of the top surface of the substrate outside a perimeter of the recess region, the peripheral contact pads being electrically connected to the one or more LED contact pads,

wherein the thick supporting plate and the peripheral contact pads each include;

an interface layer comprising a plurality of sub-layers of different metals, the plurality of sub-layers including at least a tungsten sub-layer and a nickel sub-layer; and

a copper layer,

wherein the interface layer is disposed directly on the surface of the substrate and the copper layer is disposed directly on the interface layer.

2. The light device package of claim 1 wherein the substrate includes:

a plurality of ceramic layers; and

a plurality of metal traces disposed between the ceramic layers,

wherein the metal traces provide electrical connections between the peripheral contact pads and the LED contact pads.

3. The light device package of claim 1 wherein the thick supporting plate and the peripheral contact pads have approximately the same thickness.

4. The light device package of claim 1 wherein the thick supporting plate is made of metal.

8. The light device package of claim 1 wherein the thick supporting plate has a plurality of grooves disposed therein, each of the plurality of grooves terminating at a peripheral edge of the thick supporting plate.

9. The light device package of claim 1 wherein the bottom surface of the substrate has a square shape and the thick supporting plate has a circular shape.

10. The light device package of claim 1 further comprising a plurality of LEDs disposed in the recess region of the substrate and connected to the LED contact pads.

5. A light device package comprising:

a substrate having a top surface that includes a recess region, the recess region having a plurality of LED contact pads disposed therein for connecting one or more light-emitting diodes (LEDs);

a thick supporting plate disposed over at least a portion of the bottom surface of the substrate;

a plurality of peripheral contact pads disposed on an outer area of the top surface of the substrate outside a perimeter of the recess region, the peripheral contact pads being electrically connected to the one or more LED contact pads; and

a cover member, the cover member including;

a housing shaped to fit over the top surface and side surfaces of the substrate, the housing having an opening that is positioned over the recess region when the housing is placed over the top surface and side surfaces of the substrate;

a plurality of metal contact members attached to an underside of the housing, the metal contact members arranged such that a portion of each metal contact member is held in contact with one of the peripheral contact pads when the housing is placed over the top surface and side surfaces of the substrate; and

an electrical connector disposed at a peripheral edge of the housing, wherein the metal contact members are electrically connected to the electrical connector.

6. The light device package of claim 5 wherein the housing is made of an electrically insulating material.

7. The light device package of claim 5 wherein the housing is made of a plastic.

11. A light device assembly comprising:

a light device package having;

a substrate having a top surface that includes a recess region, the recess region having one or more light-emitting diodes (LEDs) disposed therein;

a bottom supporting plate disposed over at least a portion of the bottom surface of the substrate; and

a plurality of peripheral contact pads disposed on a top surface of the substrate outside a perimeter of the recess region, the peripheral contact pads being electrically connected to the LEDs via electrically conductive pathways through the substrate;

a heat sink,

wherein the bottom supporting plate is attached to the heat sink; and

a cover member, the cover member including;

a housing shaped to fit over the top surface and side surfaces of the substrate, the housing having an opening that is positioned over the recess region when the housing is placed over the top surface and side surfaces of the substrate;

a plurality of metal contact members attached to an underside of the housing, the metal contact members arranged such that a portion of each metal contact member is held in contact with one of the peripheral contact pads when the housing is placed over the top surface and side surfaces of the substrate; and

an electrical connector disposed at a peripheral edge of the housing, wherein the metal contact members are electrically connected to the electrical connector.

12. The light device assembly of claim 11 wherein the bottom supporting plate is attached to the heat sink by a thermally conductive adhesive material.

13. The light device assembly of claim 11 wherein the bottom supporting plate is attached to the heat sink by a solder material.

14. The light device assembly of claim 11 wherein the bottom supporting plate is configured to provide mechanical support for the substrate and to provide heat transfer to the heat sink without an intervening MCPCB (metal core printed circuit board).

15. The light device assembly of claim 11 wherein the housing is attached to the heat sink.

16. A light device package comprising:

a substrate having a top surface that includes a recess region;

a plurality of LED contact pads disposed in the recess region of the top surface for connecting one or more light-emitting diodes (LEDs);

a plurality of peripheral metal contact pads electrically connected to the plurality of LED contact pads;

a plurality of LEDs, each LED being disposed on one of the plurality of LED contact pads;

a metal supporting plate disposed over at least a portion of a bottom surface of the substrate; and

a cover member disposed over the top surface of the substrate, the cover member having an opening therethrough to emit light from the plurality of LEDs, the cover member including;

a housing shaped to fit over the top surface and side surfaces of the substrate, the housing having an opening that is positioned over the recess region when the housing is placed over the top surface and side surfaces of the substrate;

a plurality of metal contact members attached to an underside of the housing, the metal contact members arranged such that a portion of each metal contact member is held in contact with one of the peripheral contact pads when the housing is placed over the top surface and side surfaces of the substrate; and

an electrical connector disposed at a peripheral edge of the housing, wherein the metal contact members are electrically connected to the electrical connector.

17. The light device package of claim 16 wherein the metal supporting plate and the peripheral metal contact pads have approximately the same thickness of about 25-40 μ

m.

18. The light device package of claim 17 wherein the metal supporting plate and the peripheral metal contact pads are made of the same material.