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Package for high-power LED devices

  • US 9,406,654 B2
  • Filed: 01/27/2014
  • Issued: 08/02/2016
  • Est. Priority Date: 01/27/2014
  • Status: Active Grant
First Claim
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1. A light device package comprising:

  • a substrate having a top surface that includes a recess region, the recess region having a plurality of LED contact pads disposed therein for connecting one or more light-emitting diodes (LEDs);

    a thick supporting plate disposed over at least a portion of the bottom surface of the substrate; and

    a plurality of peripheral contact pads disposed on an outer area of the top surface of the substrate outside a perimeter of the recess region, the peripheral contact pads being electrically connected to the one or more LED contact pads,wherein the thick supporting plate and the peripheral contact pads each include;

    an interface layer comprising a plurality of sub-layers of different metals, the plurality of sub-layers including at least a tungsten sub-layer and a nickel sub-layer; and

    a copper layer,wherein the interface layer is disposed directly on the surface of the substrate and the copper layer is disposed directly on the interface layer.

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