Light emitting device

• US 9,406,852 B2
• Filed: 05/19/2015
• Issued: 08/02/2016
• Est. Priority Date: 05/21/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Hori, Akira, Nakabayashi, Takuya
• Primary Examiner(s): Pham, Hoai V
• Application Number:
  US14/716,670
• Publication Number:
  US 20150340575A1
• Time in Patent Office: 441 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A light emitting device includes a substrate having a first main surface that serves as the light extraction surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, and that is provided an insulating base material, a pair of connection terminals disposed on the second main surface, and a heat dissipation terminal disposed on the second main surface and between the pair of connection terminals; a light emitting element that is mounted on the first main surface of the substrate and; a sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

Claims

1. A light emitting device comprising:

a substrate having a first main surface, a second main surface that is opposite the first main surface, and a mounting surface that is adjacent to at least the second main surface, the substrate including

an insulating base material,

a pair of connection terminals disposed on the second main surface,

a solder resist disposed on the second main surface, and

a heat dissipation terminal disposed between the pair of connection terminals;

a light emitting element that is mounted on the first main surface of the substrate in flip-chip manner; and

a light blocking sealing member that seals the light emitting element and is formed substantially in the same plane as the substrate on the mounting surface.

2. The light emitting device according to claim 1, wherein

the connection terminals are each extend from the first main surface, an end surface between the first main surface and the second main surface to the second main surface.

3. The light emitting device according to claim 1, wherein

a height of the heat dissipation terminal is lower than a height of the connection terminals.

4. The light emitting device according to claim 1, wherein

the solder resist is disposed between the heat dissipation terminal and the connection terminals.

5. The light emitting device according to claim 1, wherein

a plurality of light emitting elements are mounted on the first main surface and aligned in a lengthwise direction of the light emitting device.

6. The light emitting device according to claim 5, wherein

the heat dissipation terminal is disposed between the light emitting elements.

7. The light emitting device according to claim 5, further comprising

at least one second connection terminal disposed on the first main surface of the substrate, and a via formed inside the substrate, wherein

the pair of connection terminals are disposed on the first main surface,

the plurality of the light emitting elements are each mounted on two of terminals among the pair of connection terminals and at least the second connection terminal, and

the second connection terminal is connected to the heat dissipation terminal through the via.

8. The light emitting device according to claim 5, wherein

the heat dissipation terminal has a narrow part provided adjacent to the mounting surface, and a wide part that has a width wider than that of the narrow part and is provided adjacent to the narrow part and away from the mounting surface.

9. The light emitting device according to claim 5, wherein

the heat dissipation terminal has polarity.

10. The light emitting device according to claim 1, wherein

the heat dissipation terminal has a narrow part provided adjacent to the mounting surface, and a wide part that has a width wider than that of the narrow part and is provided adjacent to the narrow part and away from the mounting surface.

11. The light emitting device according to claim 10, wherein

the heat dissipation terminal has a plurality of narrow parts.

12. The light emitting device according to claim 1, wherein

the heat dissipation terminal has polarity.

13. The light emitting device according to claim 1, further comprising a light transmissive member arranged on the light emitting element.

14. The light emitting device according to claim 13, wherein the light transmissive member includes KSF-based phosphors or quantum dots.

15. The light emitting device according to claim 13, wherein side surfaces of the light transmissive member are covered by the light blocking sealing member.

16. The light emitting device according to claim 15, wherein

an upper surface of the light transmissive member has fine texturing.

17. The light emitting device according to claim 13, wherein

an upper surface of the light transmissive member has fine texturing.

18. The light emitting device according to claim 13, further comprising

a plurality of light emitting elements connected in serial, parallel, serial-parallel, or parallel-serial via a circuit configured to drive the light emitting elements independently.

19. The light emitting device according to claim 1, further comprising

a plurality of light emitting elements.

20. The light emitting device according to claim 19, wherein

the light emitting elements are connected in serial, parallel, serial-parallel, or parallel-serial via a circuit that is configured to drive the light emitting elements independently.

21. The light emitting device according to claim 1, wherein

the heat dissipation terminal is made of a metal film disposed on the second main surface with at least part of the metal film being covered by the solder resist such that an exposed part of the metal film is defined and serves as the heat dissipation terminal.