Microphone package with embedded ASIC

• US 9,407,997 B2
• Filed: 10/12/2011
• Issued: 08/02/2016
• Est. Priority Date: 10/12/2010
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Delaus, Michael D., O'Donnell, Kathy, Goida, Thomas M.
• Primary Examiner(s): Nguyen, Duc
• Assistant Examiner(s): Nguyen, Sean H
• Application Number:
  US13/272,045
• Publication Number:
  US 20120087521A1
• Time in Patent Office: 1,756 Days
• Field of Search: 257/416, 381/175, 381/369
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: B81C 1/00309 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 2203/0785 Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence

Abstract

A packaged microphone has a base, a lid coupled to the base forming an interior, a MEMS microphone secured to the base within the interior, and an integrated circuit embedded in the base. Apertures in the base and integrated circuit are aligned to form an aperture from the exterior of the package to the interior.

Claims

1. A microphone carrier comprising:

laminate base having an aperture extending through the laminate base uninterrupted;

a microphone comprising;

a microphone substrate disposed on top of the laminate base and comprising a backside cavity;

a diaphragm suspended from the microphone substrate and spanning the backside cavity;

an integrated circuit chip (IC) comprising a first IC chip side and a second IC chip side, and an IC chip aperture disposed between the first IC chip side and the second IC chip side, the IC chip being embedded in the laminate base, in its entirety, and the IC chip aperture being aligned with the aperture extending through the laminate base uninterrupted so as to allow audio signals to enter the aligned IC aperture and the aperture.

2. The microphone carrier according to claim 1, wherein the aperture is coaxially aligned with the IC chip aperture.

3. The microphone carrier according to claim 1, wherein the microphone comprises a planar diaphragm, and is mounted astride the aperture such that the plane of the diaphragm is parallel to the substrate.

4. The microphone carrier according to claim 1, wherein the substrate is a laminate.

5. The microphone carrier according to claim 1, further comprising a cap mounted to the substrate and forming an interior volume, the cap covering the aperture.

6. The microphone carrier according to claim 1, wherein the IC aperture further comprises a filter.

7. The microphone carrier according to claim 6, wherein the filter comprising a grid structure.

8. A microphone system comprising:

a substrate comprising a first side and a second side;

a lid coupled to the first side, the substrate and the lid defining an interior volume;

a microphone having a microphone substrate disposed on top of the substrate and comprising a backside cavity, the microphone further having microphone bond pads, the microphone coupled to the first side and within the interior volume and having a laminate base with an aperture extending through the laminate base uninterrupted;

an integrated circuit (IC) chip comprising a surface, with IC bond pads on the surface, the integrated circuit chip embedded, in its entirety, in the substrate and including an IC aperture aligned with the aperture so as to allow audio signals to enter the aligned IC aperture and the aperture; and

wire bonds extending from the microphone bond pads to the IC bond pads.

9. The microphone system according to claim 8, further comprising an aperture in the lid.

10. The microphone system according to claim 8, further comprising an aperture in the substrate.

11. The microphone system according to claim 8, wherein the integrated circuit chip is embedded in the substrate below the microphone.

12. The microphone system according to claim 8, wherein the integrated circuit chip is embedded in the substrate and spaced laterally from the microphone.

13. The microphone system according to claim 8, wherein the lid is conductive, and the lid and substrate form an electromagnetic shield around the microphone and integrated circuit chip.

14. A microphone carrier comprising:

a laminate base having an aperture extending through the laminate base uninterrupted;

a microphone comprising;

a microphone substrate disposed on top of the laminate base and comprising a backside cavity;

a diaphragm suspended from the microphone substrate and spanning the backside cavity;

an integrated circuit (IC) chip embedded in the laminate base, in its entirety, and including an IC aperture, the IC disposed laterally with the aperture with the IC aperture being aligned with the aperture so as to allow audio signals to enter the aligned IC aperture and the aperture.

15. The microphone carrier according to claim 14, wherein the microphone comprises a planar diaphragm, and is mounted astride the aperture such that the plane of the diaphragm is parallel to the laminate base.

16. The microphone carrier according to claim 14, further comprising a cap mounted to the substrate and forming an interior volume, the cap covering the aperture.