Bus apparatus for use with circuit interrupters or other devices

• US 9,408,292 B2
• Filed: 06/21/2012
• Issued: 08/02/2016
• Est. Priority Date: 06/21/2011
• Status: Active Grant

• Current Assignee: Labinal (Safran SA)
• Original Assignee: Labinal (Safran SA)
• Inventors: Mills, Patrick Wellington, McCormick, James Michael, Benshoff, Richard George
• Primary Examiner(s): THOMPSON, TIMOTHY J
• Assistant Examiner(s): McAllister, Michael F
• Application Number:
  US14/123,857
• Publication Number:
  US 20140110154A1
• Time in Patent Office: 1,503 Days
• Field of Search: 361/636, 361/624, 361/622, 361/644
• US Class Current: 1/1
• CPC Class Codes: H02B 1/056 Mounting on plugboards
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

An improved bus apparatus includes a generally rigid substrate and a conductor apparatus. The conductor apparatus includes a number of bus elements that are embedded within the substrate and which are electrically connected with connection elements that each have an end that is situated external to the substrate. Additional connection elements extend through the substrate and are connectable with loads. Circuit interrupters and other devices are connectable with pairs of the connector elements, wherein one connector element is connected with a line and wherein another connector element is connected with a load. The bus apparatus is formed by receiving the bus elements in channels formed in layers of a thermally conductive and electrically insulative material, and the layers are bonded together with the use of a bonding material to cause the bus elements to become laminated within the interior of the substrate.

Claims

1. A bus apparatus that is structured to enable a number of circuit interrupters or other devices to be electrically connected with a number of circuits, the bus apparatus comprising:

a substrate formed of a material that is structured to be electrically resistive and thermally conductive within the ranges of voltage and temperature in which the bus apparatus is structured to typically operate; and

a conductor apparatus comprising;

at least a first conductor assembly that comprises an electrically conductive first bus element and a number of electrically conductive first connection elements, at least some of the number of first connection elements each having an electrical connection with the first bus element, the first bus element being embedded within the substrate, the at least some of the number of first connection elements each extending from the electrical connection with the first bus element and having at least one end situated external to the substrate, and

a number of electrically conductive additional connection elements extending through the substrate and being electrically unconnected with the first bus element within the substrate, at least some of the number of additional connection elements each having at least one end situated external to the substrate, wherein

at least some of the additional connection elements are mounted to a printed circuit board, the printed circuit board including a connector that includes pins that provide one or more data channels that communicate to a remote location data derived by circuits situated on the printed circuit board,

wherein the substrate comprises a plurality of layers bonded together, the plurality of layers comprising a first layer and a second layer, at least a portion of the first bus element being interposed between the first and second layers, at least one of the first layer and the second layer having formed therein an elongated channel, at least a portion of the bus element being situated in at least a portion of the channel,

wherein the plurality of layers further comprise a third layer, and wherein the conductor apparatus further comprises a second conductor assembly that comprises an electrically conductive second bus element and a number of electrically conductive second connection elements, at least a portion of the second bus element being interposed between the second and third layers, the second bus element being embedded within the substrate, the at least some of the number of second connection elements each extending from the electrical connection with the second bus element and having at least one end situated external to the substrate

wherein;

the substrate comprises a generally planar first exterior surface;

at least some of the first connection elements each have the at least one end thereof protruding from the first exterior surface;

at least some of the second connection elements each have the at least one end thereof protruding from the first exterior surface; and

at least some of the additional connection elements each have the at least one end thereof protruding from the first exterior surface

wherein the substrate further comprises a generally planar second exterior surface situated opposite the first exterior surface, and wherein at least some of the additional connection elements each have a second end thereof protruding from the second exterior surface, the second ends being structured to be electrically connected with a number of circuits, and

wherein at least some of the additional connection elements each comprise an elongated shank and a support element protruding from the shank in a direction transverse to the direction of elongation, the support element being engaged with a layer from among the plurality of layers.

2. The bus apparatus of claim 1 wherein the first layer has a plurality of first holes formed therein, and wherein the second layer has a plurality of second holes formed therein, at least some of the first connection elements being received in both a first hole and a second hole.

3. The bus apparatus of claim 1 wherein the at least one end of one of the number of first connection elements is situated adjacent a corresponding at least one end of one of the number of additional connection elements, and wherein the at least one end of one of the number of second connection elements is situated adjacent another corresponding at least one end of one of the number of additional connection elements.

4. The bus apparatus of claim 1 wherein the at least first conductor assembly comprises as the number of electrically conductive first connection elements a plurality of the first connection elements, at least one of the first connection elements comprising a connector that is structured to be electrically connected with a line conductor, another of the first connection elements and one of the additional connection elements being structured to be electrically connected with a circuit interrupter or other device, a further one other of the first connection elements and another of the additional connection elements being structured to be electrically connected with another circuit interrupter or other device.

5. The bus apparatus of claim 1 wherein the substrate is structured to be bonded together with the printed circuit board.