Patterned transparent conductors and related manufacturing methods

• US 9,408,297 B2
• Filed: 01/23/2015
• Issued: 08/02/2016
• Est. Priority Date: 08/24/2011
• Status: Active Grant

• Current Assignee: TPK Holding Co., Ltd.
• Original Assignee: TPK Holding Co., Ltd.
• Inventors: Srinivas, Arjun Daniel, Robinson, Matthew R., Mittal, Alexander Chow, Young, Michael Eugene, Buchanan, David, George, Joseph, Yoshioka, Yuka
• Primary Examiner(s): Norris, Jeremy C
• Assistant Examiner(s): Milakovich, Nathan
• Application Number:
  US14/604,529
• Publication Number:
  US 20150129286A1
• Time in Patent Office: 557 Days
• Field of Search: 174/250, 174/256, 428/323, 428/327
• US Class Current: 1/1
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/045 using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 3/0091 Apparatus for coating printed circuits using liquid non-metallic coating compositions
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: Y10S 977/932 for electronic or optoelectronic application
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/254 Polymeric or resinous material

Abstract

A patterned transparent conductor includes: (1) a substrate; (2) first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and (3) second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion. A sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.

Claims

1. A patterned transparent conductor comprising:

a substrate;

first additives at least partially embedded into a surface of the substrate within a first area of the surface corresponding to a lower sheet resistance portion; and

second additives at least partially embedded into the surface of the substrate within a second area of the surface corresponding to a higher sheet resistance portion,

wherein a sheet resistance of the higher sheet resistance portion is at least 100 times a sheet resistance of the lower sheet resistance portion.

2. The patterned transparent conductor of claim 1, wherein the first additives correspond to first metallic nanowires, the second additives correspond to second metallic nanowires, and the second metallic nanowires are treated to inhibit at least one of formation of a percolating network and conductivity of the network.

3. The patterned transparent conductor of claim 1, wherein the first additives have an aspect ratio of at least 3, and at least one of the second additives has an aspect ratio less than 3.

4. The patterned transparent conductor of claim 1, wherein an extent of embedding of the second additives within the higher sheet resistance portion is greater than an extent of embedding of the first additives within the lower sheet resistance portion.

5. The patterned transparent conductor of claim 1, wherein the first additives are localized within a depth from the surface that is no greater than 50% of a thickness of the substrate.

6. The patterned transparent conductor of claim 1, wherein at least one of the first additives includes a portion exposed at or above the surface of the substrate.

7. The patterned transparent conductor of claim 1, wherein at least one of the second additives is embedded below the surface of the substrate.