CMUT packaging for ultrasound system

• US 9,408,588 B2
• Filed: 12/03/2008
• Issued: 08/09/2016
• Est. Priority Date: 12/03/2007
• Status: Active Grant

• Current Assignee: Kolo Medical, Ltd.
• Original Assignee: Kolo Technologies, Inc.
• Inventors: Huang, Yongli
• Primary Examiner(s): Gupta, Vani
• Application Number:
  US12/745,754
• Publication Number:
  US 20100280388A1
• Time in Patent Office: 2,806 Days
• Field of Search: 600/459, 600/439, 600/457, 600/462, 600/466, 310/334, 438/48, 738/612.7, 367/181, 257/296, 257/668
• US Class Current: 1/1
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: A61B 8/445 Details of catheter construction
• CPC Class Codes: A61B 8/4483 characterised by features of the ultrasound transducer
• CPC Class Codes: A61B 8/4488 the transducer being a phased array
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: B06B 1/0651 of circular shape
• CPC Class Codes: B06B 3/00 Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: Y10T 29/49005 Acoustic transducer

Abstract

Ultrasonic scanners and methods of manufacturing ultrasonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.

Claims

1. A method of packaging an ultrasonic system, the method comprising:

disposing, on a substrate, a capacitive micromachined ultrasonic transducer (CMUT) and an integrated circuit (IC);

applying an insulation layer of a first material and a conductive layer of a second material to the substrate and at least one of the CMUT or the IC;

removing the substrate to obtain a subassembly comprising;

the insulation layer,

the conductive layer,

the CMUT, and

the IC; and

shaping the subassembly to have at least one curved part.

2. The method of claim 1 wherein the first material is a flexible polymer.

3. The method of claim 1 wherein at least one of the CMUT or the IC is disposed on the substrate by being placed into a structure formed on the substrate.

4. The method of claim 1 wherein at least one of the CMUT or the IC is disposed on the substrate by being fabricated on a device layer of the substrate before the applying the insulation layer and the conductive layer.

5. The method of claim 4 further comprising forming a trench in the device layer of the substrate to define a portion of a boundary of at least one of the CMUT or the IC.

6. The method of claim 5 further comprising forming the device layer with at least one embedded cavity.

7. The method of claim 4 further comprising forming the device layer on a SOI wafer, wherein the substrate comprises at least the device layer and the SOI wafer.

8. The method of claim 1, wherein:

the applying the insulation layer comprises applying the insulation layer, at least partially, over the IC and the CMUT to mechanically connect the CMUT and the IC; and

the applying the conductive layer comprises applying the conductive layer to electrically connect the CMUT and the IC.

9. The method of claim 1 wherein the disposing comprises fabricating the CMUT on the substrate prior to the applying the insulation layer and the conductive layer, the method further comprising connecting the IC to the conductive layer on a side of the insulation layer opposite to the CMUT.

10. The method of claim 1 wherein the shaping the subassembly further comprises shaping the subassembly to define a lumen or a partial lumen.

11. The method of claim 1 the method further comprising forming a through-wafer interconnect in the CMUT, wherein the at least one conductive layer is on a side of the CMUT that does not include an active surface of the CMUT.

12. The method of claim 1 further comprising attaching the shaped subassembly to a lumen.

13. The method of claim 1 wherein the CMUT includes an array of CMUTs.

14. The method of claim 1, wherein the shaping further comprising folding a portion of the at least one insulation layer and the at least one conductive layer to form a forward looking ultrasonic transducer.

15. The method of claim 1 wherein:

at least prior to the shaping, the CMUT includes at least a portion of a circular CMUT array.

16. The method of claim 1 wherein the insulation layer and the conductive layer make up at least a portion of a flexible member, such that one of the IC or the CMUT is integrated on a first side of the flexible member, the method further comprising integrating the other one of the IC or the CMUT on an opposite side of the flexible member.

17. An ultrasonic system comprising:

a plurality of electronic integrated circuits (ICs);

an ultrasonic transducer; and

a flexible member extending between and integrated with the ICs and the ultrasonic transducer, the flexible member including at least one insulation layer and at least one conductive layer,

wherein the flexible member is shaped into a folded configuration so that at least one of the ICs is stacked over another one of the ICs, the ultrasonic transducer is stacked over the stacked ICs, and at least a portion of the flexible member defines a layer between the ultrasonic transducer and the stacked ICs.

18. The system of claim 17 wherein the flexible member includes at least one layer of a flexible polymer.

19. The system of claim 17 wherein the flexible member includes:

a first flexible insulation layer,

a flexible patterned conductive layer including a plurality of interconnects between the ICs and the ultrasonic transducer, and

a second flexible insulation layer, such that at least a portion of the conductive layer is between the first flexible insulation layer and the second flexible insulation layer.

20. The system of claim 17 wherein the ultrasonic transducer includes a through-wafer interconnect.

21. The system of claim 17 wherein the ultrasonic transducer includes at least one capacitive micromachined ultrasonic transducer element.

22. The system of claim 17 wherein the ultrasonic transducer is a capacitive micromachined ultrasonic transducer (CMUT) array including at least two CMUT elements.

23. The system of claim 17 further comprising at least one of a temperature sensor or pressure sensor integrated with the flexible member.

24. The system of claim 17 wherein the ultrasonic transducer includes at least a portion of a circular capacitive micromachined ultrasonic transducer array that is circular at least prior to the shaping.

25. The system of claim 17 wherein the flexible member is integrated with at least one of the CMUT or the ICs by at least one of coating, evaporating, sputtering or deposition.

26. A method of manufacturing an ultrasonic system, the method comprising:

providing a substrate with a capacitive micromachined ultrasonic transducer (CMUT);

patterning an insulation layer onto the substrate and the CMUT;

patterning a conductive layer onto a portion of the insulation layer, the conductive layer conductively connecting to the CMUT, wherein the CMUT, the insulation layer, and the conductive layer make up at least a portion of a flexible subassembly;

removing the flexible subassembly from the substrate; and

shaping the flexible subassembly.

27. The method of claim 26, further comprising:

prior to removing the flexible subassembly from the substrate, forming a plurality of bonding pads on the flexible subassembly, the bonding pads conductively connecting to the conductive layer; and

connecting an electrical integrated circuit to the plurality of bonding pads.

28. The method of claim 26, further comprising:

providing the substrate with an electrical integrated circuit (IC) on the substrate; and

patterning the conductive layer to conductively connect to the IC.

29. The method of claim 26, wherein the providing the substrate with the CMUT comprises at least one of:

fabricating the CMUT on the substrate;

or

placing the CMUT on the substrate.

30. A method comprising:

disposing a capacitive micromachined ultrasonic transducer (CMUT) on a wafer;

applying an insulation layer of a first material and a conductive layer of a second material to the wafer and the CMUT;

removing the wafer to obtain a subassembly comprising;

the insulation layer,

the conductive layer, and

the CMUT; and

shaping the subassembly to have at least one curved part.

31. The method as recited in claim 30, further comprising:

bonding an integrated circuit (IC) to the subassembly on a side of the insulation layer opposite to the CMUT; and

electrically connecting the IC to the CMUT via the conductive layer.

32. The method as recited in claim 30, further comprising, prior to the applying the insulation layer, forming a trench in the wafer to define at least a portion of a boundary of the CMUT.

33. The method as recited in claim 30, further comprising, prior to the applying the insulation layer, disposing an integrated circuit on the wafer, wherein the applying the insulation layer includes applying the insulation layer to the integrated circuit.