LED lamp with filament style LED assembly

• US 9,410,687 B2
• Filed: 02/22/2013
• Issued: 08/09/2016
• Est. Priority Date: 04/13/2012
• Status: Active Grant

• Current Assignee: IDEAL Industries Lighting, LLC (Ideal Industries Incorporated)
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Hussell, Christopher P., Edmond, John Adam, Negley, Gerald H., Progl, Curt, Edmond, Mark, Athalye, Praneet, Swoboda, Charles M., van de Ven, Antony Paul, Pickard, Paul Kenneth, Reier, Bart P., Lay, James Michael, Lopez, Peter E.
• Primary Examiner(s): Williams, Joseph L
• Application Number:
  US13/774,078
• Publication Number:
  US 20130271981A1
• Time in Patent Office: 1,264 Days
• US Class Current: 1/1
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 19/003 Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
• CPC Class Codes: F21V 19/004 by deformation of parts or snap action mountings, e.g. using clips
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/777 the planes containing the fins or blades having directions perpendicular to the light emitting axis
• CPC Class Codes: F21V 7/00 Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: F21Y 2107/30 on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
• CPC Class Codes: F21Y 2107/40 on the sides of polyhedrons, e.g. cubes or pyramids
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: Y10T 29/49826 Assembling or joining

Abstract

A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.

Claims

1. A lamp comprising:

an optically transmissive enclosure;

a base connected to the enclosure to define an interior space in the optically transmissive enclosure and a longitudinal axis extending from the base to the enclosure;

a tower extending from the base and extending into the interior space of the optically transmissive enclosure and supporting an LED assembly in the optically transmissive enclosure, the LED assembly comprising a plurality of LEDs operable to emit light when energized through an electrical path from the base, the tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band at the optical center of the enclosure along the longitudinal axis and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament.

2. The lamp of claim 1 wherein the tower comprises a portion of a heat sink for dissipating heat from the LED assembly.

3. The lamp of claim 2 wherein a second portion of the heat sink extends to an exterior of the enclosure.

4. The lamp of claim 2 wherein the LED assembly comprises a submount on which the plurality of LEDs are mounted, the submount has a three-dimensional shape where a portion of the heat sink is inside of the submount and the plurality of LEDs are mounted on an outside surface of the submount.

5. The lamp of claim 4 wherein the submount comprises a connector portion that couples the LED assembly to the heat sink and electrically couples the LED assembly to the electrical path.

6. The lamp of claim 1 wherein the LED assembly comprises a submount on which the plurality of LEDs are mounted.

7. The lamp of claim 6 wherein the submount comprises at least one of a PCB, metal core board, lead frame and metal core printed circuit board.

8. The lamp of claim 1 wherein the tower extends along the longitudinal axis of the lamp and the LED assembly is mounted on the tower such that at least some of the LEDs of the plurality of LEDs emit light laterally.

9. The lamp of claim 1 wherein the plurality of LEDs are positioned in a band about the tower such that a high intensity area of light produced from the plurality of LEDs appears as a glowing line of light when energized.

10. The lamp of claim 9 wherein the band has a height and the tower has a diameter, the height of the band, in the dimension along a longitudinal axis of the lamp, being smaller than the diameter of the tower.

11. A lamp comprising:

an optically transmissive enclosure defining an interior space;

a base;

an LED assembly connected to the base and extending into the optically transmissive enclosure, the LED assembly comprising a plurality of LEDs operable to emit light when energized through an electrical path from the base, a tower having a diameter extending into the interior space and supporting the LED assembly, the tower and the LED assembly are arranged such that the plurality of LEDs are disposed about a longitudinal axis of the lamp in a band and face outwardly toward the enclosure to create a source of the light that produces a high intensity area of light that appears as a glowing line of light when energized, wherein the band has a height and the tower has a diameter, the height of the band, in the dimension along the longitudinal axis of the lamp, being smaller than the diameter of the tower.

12. A lamp comprising:

an optically transmissive enclosure having single opening;

a base;

a tower extending from the base into the enclosure through the opening and supporting an LED assembly in the optically transmissive enclosure, wherein the tower comprises a first portion of a heat sink for dissipating heat from the LED assembly and a second portion of the heat sink that extends to an exterior of the enclosure, the enclosure being connected to the second portion at the opening such that the enclosure is completely enclosed, the LED assembly comprising a plurality of LEDs operable to emit light when energized through an electrical path from the base where the plurality of LEDs are operated at a current level per area of EPI area such that heat generated by the plurality of LEDs may be adequately dissipated from the lamp by the heat sink, the LED assembly comprising a flat submount on which a plurality of LEDs are mounted, the flat submount being bent into a three-dimensional shape and being mounted on a tower, the LED assembly and tower being dimensioned to fit in the opening, and the LED assembly being arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that is appears as a glowing filament.

13. The lamp of claim 12 wherein the submount comprises at least one of a PCB, metal core board, lead frame and metal core printed circuit board.

14. The lamp of claim 12 wherein the submount comprises a connector portion that couples the LED assembly to the heat sink and electrically couples the LED assembly to the electrical path.

15. The lamp of claim 12 wherein the tower extends along the longitudinal axis of the lamp and the LED assembly is mounted on the tower such that the plurality of LEDs encircle the longitudinal axis.

16. The lamp of claim 15 wherein the submount comprises a connector portion that couples the LED assembly to the heat sink and electrically couples the LED assembly to the electrical path.

17. The lamp of claim 12 wherein the band has a height and the tower has a diameter, the height of the band, in the dimension along a longitudinal axis of the lamp, being smaller than the diameter of the tower.

18. The lamp of claim 12 further comprising an electrical interconnect for connecting a conductor to the tower where the conductor is in the electrical path between the LED assembly and the base.

19. The lamp of claim 18 wherein the electrical conductor connects the LED assembly to lamp electronics in the base.

20. A method of making a lamp comprising:

providing an optically transmissive enclosure having a single opening and defining an interior space;

providing a heat sink comprising a tower dimensioned to fit into the opening and to extend into the interior space of the enclosure;

mounting a plurality of LEDs on a flat substrate;

bending the flat substrate into a three-dimensional shape;

mounting the substrate on the tower;

inserting the tower and substrate into the interior space of the enclosure through the opening;

connecting the heat sink to the enclosure such that the tower extends into the interior space and the enclosure is completely enclosed.