Heat dissipating assembly

• US 9,410,688 B1
• Filed: 05/09/2014
• Issued: 08/09/2016
• Est. Priority Date: 05/09/2014
• Status: Expired due to Fees

• Current Assignee: Silescent Lighting Corporation
• Original Assignee: Silescent Lighting Corporation
• Inventors: Sutherland, Mark, Suarez, Jose
• Primary Examiner(s): Ton, Anabel
• Application Number:
  US14/273,947
• Time in Patent Office: 823 Days
• Field of Search: 362/218, 362/373, 362/294, 362/249.02
• US Class Current: 1/1
• CPC Class Codes: F21V 29/10 Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/508 of electrical circuits
• CPC Class Codes: F21V 29/85 characterised by the material liquid coolants F21V29/56
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

An assembly for the dissipation of heat from an illumination structure of the type which includes one or more LEDs and a driver assembly operatively connected to the one or more LEDs. A primary heat sink is disposed in heat transferring relation to the components of a remainder of the illumination structure. A mount, also formed of a heat conductive material, is disposed in supporting or connected relation to the driver and in heat transferring relation to the primary heat sink. A compartment structure includes a hollow interior chamber, having heat insulating fluid disposed therein, and disposed in adjacent and/or aligned relation with the one LED so as to insulate it from heat generated by the driver assembly and other components of the light structure. The mount, primary heat sink and compartment structure are cooperatively disposed so as to define a flow path of heat away from the one or more LEDs to an area where it is dissipated exteriorly of the illumination structure.

Claims

1. An assembly for the dissipation of heat from an illumination structure, which includes at least one LED, said assembly comprising:

a driver assembly operatively connected to the one LED and defining a part of the illumination structure,

a primary heat sink formed of heat conductive material and disposed in heat transferring relation to remaining portions of the illumination structure,

a mount disposed in at least partially interconnecting relation between said driver assembly and remaining portions of the illumination structure,

a compartment structure disposed and structured to at least partially insulate the one LED from heat generated by at least some of the remaining portions of the illumination structure, and

said compartment structure at least partially disposed on said mount in adjacent relation to the one LED.

2. An assembly as recited in claim 1 wherein said compartment structure comprises an interior chamber having an at least partially hollow interior and including a heat insulating fluid disposed within said hollow interior.

3. An assembly as recited in claim 2 wherein said compartment structure and said interior chamber collectively comprise an air pocket.

4. An assembly as recited in claim 2 wherein said interior chamber is disposed in substantially heat insulating relation to the one LED, relative to said driver assembly.

5. An assembly as recited claim 2 wherein said interior chamber is disposed in heat insulating relation to the one LED and between and in substantially aligned relation with said driver assembly and the one LED.

6. An assembly as recited in claim 2 wherein said interior chamber is disposed in substantially adjacent relation to the one LED.

7. An assembly as recited in claim 6 wherein said interior chamber comprises a heat insulating fluid disposed therein.

8. An assembly as recited in claim 6 wherein said mount is formed of a heat conductive material and disposed in heat transferring relation to said driver assembly.

9. An assembly as recited in claim 6 wherein said mount is formed of a heat conductive material and disposed to at least partially define a flow path of heat from said driver assembly to said primary heat sink.

10. An assembly as recited in claim 9 wherein said primary heat sink is disposed between said mount and the one LED and in heat transferring relation to said mount.

11. An assembly as recited in claim 10 wherein said mount and said primary heat sink collectively and at least partially define a flow path of heat from said driver assembly to an exterior of the illumination structure.

12. An assembly as recited in claim 10 wherein said primary heat sink is disposed in heat transferring relation to the one LED.

13. An assembly as recited in claim 6 wherein said primary heat sink at least partially defines a flow path of heat from said driver assembly and the one LED to an exterior of the illumination structure.

14. An assembly as recited in claim 13 wherein said interior chamber comprises an at least partially hollow interior including a heat insulating fluid disposed therein.

15. An assembly for the dissipation of heat from an illumination structure including at least one LED, said assembly comprising:

a driver assembly operatively connected to the one LED,

a primary heat sink formed of heat conductive material and disposed in heat transferring relation to the illumination structure,

a mount at least partially formed of heat conductive material and disposed in heat transferring relation between the driver assembly and said primary heat sink,

a compartment structure at least partially disposed between said mount and the one LED and including an interior chamber having heat insulating fluid disposed therein,

said interior chamber disposed and dimensioned to at least partially insulate the one LED from heat generated from at least said driver assembly, and

said compartment structure and said interior chamber are disposed on said mount.

16. An assembly as recited in claim 15 wherein said interior chamber is disposed in substantially adjacent, heat insulating relation to said one LED.

17. An assembly as recited in claim 15 wherein said interior chamber is at least partially formed in said mount in substantially aligned relation between said driver assembly and the one LED.

18. An assembly as recited in claim 15 wherein said compartment structure is at least partially formed on said mount adjacent said primary heat sink and in adjacent, aligned, heat insulating relation to the one LED.

19. An assembly as recited in claim 15 wherein said mount comprises a secondary heat sink disposed in engaging, heat transferring relation with said driver assembly and said primary heat sink.

20. An assembly as recited in claim 19 wherein said compartment structure is disposed at least partially between said secondary heat sink and said primary heat sink, said interior chamber disposed between and in substantially aligned relation to said driver assembly and the one LED.

21. An assembly as recited in claim 20 wherein said insulating fluid comprises air, said compartment structure and said interior chamber collectively defining an air pocket.