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Hydronic building systems control

  • US 9,410,752 B2
  • Filed: 08/16/2013
  • Issued: 08/09/2016
  • Est. Priority Date: 08/17/2012
  • Status: Active Grant
First Claim
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1. A method for controlling heating and cooling in a conditioned space, the method comprising the steps of:

  • (a) receiving in a microprocessor controller a desired set point temperature and a desired set point humidity;

    (b) receiving in the microprocessor controller a plurality of sensor inputs from a plurality of sensors, wherein the plurality of sensors sense at least one temperature and at least one relative humidity;

    (c) processing by the microprocessor controller the plurality of sensor inputs from the plurality of sensors in light of the desired set point temperature and the desired set point relative humidity;

    (d) calculating and tracking by the microprocessor controller a first dew point in a fresh intake air moving into a dehumidifying device; and

    a second dew point in a thermally conductive structure in the conditioned space;

    (e) sending a plurality of digital signals from the microprocessor controller to a devices controller; and

    (f) sending a plurality of control signals from the devices controller to a plurality of devices, the plurality of devices selected from the group consisting of analog devices and digital devices, wherein the plurality of devices upon receiving the plurality of control signals achieve the desired set point temperature and the desired set point humidity in the conditioned space by;

    (i) circulating a fluid within at least one of the thermally conductive structure and the dehumidifying device, wherein the dehumidifying in fluid connection with the thermally conductive structure;

    (ii) moving the fresh intake air through the dehumidifying device and into the conditioned space;

    (iii) keeping a first temperature of the fluid less than the first dew point at the dehumidifying device; and

    (iv) keeping a second temperature of the fluid greater than the second dew point at the thermally conductive structure.

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