Integrated circuit package having a split lead frame and a magnet
First Claim
Patent Images
1. A magnetic field sensor comprising:
- a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion and a die attach portion;
a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads adjacent to the first surface of the lead frame with a non-conductive attachment mechanism;
a separately formed ferromagnetic element disposed adjacent to the lead frame; and
a passive component coupled to the at least two leads, wherein the die attach portion of at least one of the plurality of leads has a first portion that is separated from a second portion and wherein the magnetic field sensor further comprises a passive component coupled between the first portion and second portion of the die attach portion.
7 Assignments
0 Petitions
Accused Products
Abstract
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads and a separately formed ferromagnetic element, such as a magnet, is disposed adjacent to the lead frame.
-
Citations
63 Claims
-
1. A magnetic field sensor comprising:
-
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion and a die attach portion; a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads adjacent to the first surface of the lead frame with a non-conductive attachment mechanism; a separately formed ferromagnetic element disposed adjacent to the lead frame; and a passive component coupled to the at least two leads, wherein the die attach portion of at least one of the plurality of leads has a first portion that is separated from a second portion and wherein the magnetic field sensor further comprises a passive component coupled between the first portion and second portion of the die attach portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
-
-
27. A magnetic field sensor comprising:
-
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion and a die attach portion; a magnet attached to the die attach portions of the at least two leads adjacent to the first surface of the lead frame; and a semiconductor die supporting a magnetic field sensing element and attached to the magnet and spaced from the lead frame by the magnet. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
-
-
45. A magnetic field sensor comprising:
-
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads are electrically isolated from each other and wherein each of the at least two leads has an elongated connection portion and a die attach portion; a semiconductor die supporting a magnetic field sensing element and attached to the die attach portions of the at least two leads adjacent to the first surface of the lead frame with a non-conductive attachment mechanism; a hard ferromagnetic element adjacent to the second surface of the lead frame; and a soft ferromagnetic element coupled to the hard ferromagnetic element to form a concentrator. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63)
-
Specification