Writer pole formation
First Claim
1. A method comprising:
- removing a part of at least one metallic writer pole layer on top of an intermediate stage writer pole wafer to form a recovery trench;
depositing an optically transparent material on top of the wafer, wherein the thickness of the optically transparent material is higher than a target recovery trench topography;
forming a photoresist pattern on top of the optically transparent material over the recovery trench;
etching the optically transparent material; and
removing the photoresist pattern and at least part of the remaining optically transparent material.
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Accused Products
Abstract
Implementations disclosed herein provide a method of reducing the topography at the alignment and overlay marks area during the writer pole photolithography process in order to reduce the wafer scale variation and reduce the writer pole photolithography process rework rate. In one implementation, an intermediate stage of a wafer for writer pole formation is generated by removing a part of at least one metallic writer pole layer on top of an intermediate stage writer pole wafer to form a recovery trench, depositing an optically transparent material on top of the wafer, wherein the thickness of the optically transparent material is higher than a target recovery trench topography, forming a photoresist pattern on top of the optically transparent material over the recovery trench, etching the optically transparent material, and removing the photoresist pattern and at least part of the remaining optically transparent material.
15 Citations
20 Claims
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1. A method comprising:
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removing a part of at least one metallic writer pole layer on top of an intermediate stage writer pole wafer to form a recovery trench; depositing an optically transparent material on top of the wafer, wherein the thickness of the optically transparent material is higher than a target recovery trench topography; forming a photoresist pattern on top of the optically transparent material over the recovery trench; etching the optically transparent material; and removing the photoresist pattern and at least part of the remaining optically transparent material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method of forming an intermediate stage writer pole wafer comprising:
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removing a part of at least one metallic writer pole layer on top of the writer pole wafer to form a recovery trench; depositing alumina on top of the wafer filling the recovery trench, wherein a thickness of the alumina is higher than a target recovery trench topography; forming a photoresist pattern on top of the alumina over the recovery trench; wet etching the alumina; and chemically removing the photoresist; and removing at least part of a remaining part of the alumina. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification