OLED fabrication using laser transfer

• US 9,412,947 B2
• Filed: 09/14/2012
• Issued: 08/09/2016
• Est. Priority Date: 09/14/2012
• Status: Active Grant

• Current Assignee: Universal Display Corporation
• Original Assignee: Universal Display Corporation
• Inventors: Weaver, Michael Stuart, Hack, Michael, Brown, Julia J.
• Primary Examiner(s): Leong, Nathan T
• Application Number:
  US13/618,445
• Publication Number:
  US 20140077164A1
• Time in Patent Office: 1,425 Days
• US Class Current: 1/1
• CPC Class Codes: H10K 50/13 comprising stacked EL layers within one EL unit
• CPC Class Codes: H10K 71/18 using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet

Abstract

Techniques for fabricating organic light emitting devices, and devices fabricating using the disclosed techniques, are provided. In the disclosed techniques, a layer including an emissive material and a buffer material may be deposited in a single laser transfer process, such as a laser-induced thermal imaging process. The emissive and buffer materials may be deposited in discrete layers during the transfer process. Examples of buffer materials as disclosed include blocking materials, transfer materials, and the like. Additional layers may be deposited using conventional techniques or additional laser transfer processes.

Claims

1. A method comprising:

depositing a first layer over a substrate;

depositing a second layer over the first layer via a laser transfer process, the second layer comprising a first emissive material and a first buffer material, the first emissive material forming a layer having a first side and a second side that is opposite to the first side, wherein the first buffer material is disposed on the first side of the first emissive material for application to the first layer, and no buffer material is disposed on the second side of the first emissive material during the laser transfer process to fabricate a light emitting device; and

depositing a third layer over the second layer of the light emitting device.

2. A method as recited in claim 1, wherein the first buffer material comprises a blocking material.

3. A method as recited in claim 1, wherein the first buffer material comprises a transport material.

4. A method as recited in claim 1, wherein, after being deposited over the substrate, the emissive material is disposed in a layer over the buffer material.

5. A method as recited in claim 1, wherein the second layer further comprises a second buffer material.

6. A method as recited in claim 1, wherein the second layer further comprises a second emissive material.

7. A method as recited in claim 1, wherein the second layer comprises a plurality of emissive materials, each of the plurality of emissive materials having a different peak emission wavelength.

8. A method as recited in claim 1, further comprising depositing a fourth layer over the first layer in a second single laser thermal transfer process, the second layer comprising a second emissive material.

9. A method as recited in claim 8, wherein the fourth layer comprises a second buffer material.

10. A method as recited in claim 1, wherein the first emissive material comprises an organic emissive material.

11. A method as recited in claim 1, wherein the first buffer material comprises an organic material.

12. A method as recited in claim 1, wherein the step of depositing the first layer comprises depositing the first layer by vacuum thermal evaporation.

13. A method as recited in claim 1, wherein the step of depositing the third layer comprises depositing the third layer by vacuum thermal evaporation.

14. A method as recited in claim 1, wherein the first layer comprises a transport layer.

15. A method as recited in claim 1, wherein the third layer comprises a transport layer.

16. A method as recited in claim 1, wherein the third layer comprises an electrode.