Method of manufacturing an electronic high-current circuit by means of gas injection technology and sealing with an insulating polymer

• US 9,414,483 B2
• Filed: 10/03/2013
• Issued: 08/09/2016
• Est. Priority Date: 10/05/2012
• Status: Active Grant

• Current Assignee: Vitesco Technologies GmbH (Continental AG)
• Original Assignee: Continental Automotive GmbH (Continental AG)
• Inventors: Mattmann, Erich
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/045,329
• Publication Number:
  US 20140138124A1
• Time in Patent Office: 1,041 Days
• Field of Search: 174/251, 361/311, 361/313, 257/E21.008, 257/E21.277, 257/E21.477, 257/E21.499, 257/E21.508, 257/E21.512, 257/E21.703, 257/E23.021, 257/779, 257/737, 257/782
• US Class Current: 1/1
• CPC Class Codes: H05K 1/0265 characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/10969 Metallic case or integral heatsink of component electrically connected to a pad on PCB
• CPC Class Codes: H05K 2203/1344 Spraying small metal particles or droplets of molten metal
• CPC Class Codes: H05K 3/102 by bonding of conductive powder, i.e. metallic powder H05K3/12 takes precedence
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor.

Claims

1. A method for manufacturing an electric circuit, the electric circuit having:

a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer protective layer, the method comprising;

a) applying the insulation layer onto the carrier surface using a high-speed gas spray process, the insulation layer consisting of aluminum oxide ceramic,

b1) applying the strip conductor onto the insulation layer,

b2) applying a bonding layer in a partial area of the strip conductor,

c) applying the protective layer by a screen printing process for covering the insulation layer, the strip conductor, and the bonding layer, whereby the protective layer has at least one recess to provide an electric contact area to the strip conductor, such that the protective layer and the bonding layer form an overlapping area along the edges of the bonding layer, and

d) filling the at least one recess with a solder material.

2. The method in accordance with claim 1, wherein the at least one recess is arranged within a partial area of the strip conductor.

3. The method in accordance with claim 1, wherein the protective layer contains a material selected from the group of polymers.

4. The method in accordance with claim 1, the protective layer contains a material selected from the group of silicones.