RFID tags and processes for producing RFID tags

• US 9,418,328 B2
• Filed: 12/03/2014
• Issued: 08/16/2016
• Est. Priority Date: 03/24/2003
• Status: Active Grant

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Inventors: Gengel, Glenn W., Hadley, Mark A., Pounds, Tom, Schatz, Kenneth D., Drzaic, Paul S.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US14/559,695
• Publication Number:
  US 20150242739A1
• Time in Patent Office: 622 Days
• Field of Search: 340/572.7
• US Class Current: 1/1
• CPC Class Codes: D10B 2401/18 including electronic components
• CPC Class Codes: G06K 19/027 the material being suitable for use as a textile, e.g. woven-based RFID-like labels designed for attachment to laundry items markings attached to laundry items in general D06F93/00
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 2224/24227 the HDI interconnect not connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the semiconductor or solid-state body being mounted in a cavity or on a protrusion of the item
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82039 using a laser
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01051 Antimony [Sb]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: Y10T 29/49018 : with other electrical component
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base

Abstract

A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of the integrated circuit is coplanar with the flexible substrate. At least one conductive element is formed on the flexible substrate. The conductive element is electrically connected to the integrated circuit. The conductive element serves as an antenna for the RFID tag.

Claims

1. An RFID tag comprising:

a flexible substrate having a hole;

an integrated circuit at least partially embedded within the hole in the flexible substrate, the integrated circuit having a top surface that is substantially coplanar with the flexible substrate;

conductive elements formed on the flexible substrate and electrically connected to the integrated circuit, the conductive elements including a first conductive element and a second conductive element, the first and the second conductive elements also serving as an antenna for the RFID tag; and

wherein the first conductive element is formed on a top surface of the flexible substrate and the second conductive element is formed on the bottom surface of the flexible substrate, and wherein an electrical connection is provided to connect the second conductive element to the integrated circuit.

2. The RFID tag of claim 1 wherein the first conductive element and the second conductive element form an inductive loop.

3. The RFID tag of claim 1 wherein a length of the RFID tag is at least 10 times a width of the RFID tag.

4. The RFID tag of claim 1 wherein a planarization layer covers at least a portion of the integrated circuit on the top surface.

5. The RFID tag of claim 1 wherein an angular orientation of the integrated circuit in the hole is not fixed by the hole.

6. The RFID tag of claim 5 wherein the angular orientation is capable of being a plurality of orientations.