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Semiconductor package and method of manufacturing the same

  • US 9,418,943 B2
  • Filed: 06/15/2015
  • Issued: 08/16/2016
  • Est. Priority Date: 09/17/2014
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a package substrate on which a semiconductor chip is mounted;

    a molding layer that covers the package substrate and molds the semiconductor chip; and

    a marking film disposed on the molding layer, wherein the marking film comprises a thermoreactive layer that reacts to an electromagnetic wave;

    wherein the thermoreactive layer comprises both thermoreactive material and reflector material;

    the thermoreactive material includes a discoloration material and/or a carbonization material, and the thermoreactive material has a crystal structure comprising first crystal grains; and

    ,the reflector material reflects the electromagnetic wave and has a crystal structure comprising second crystal grains, and the second crystal grains are dispersed in a space between the first crystal grains.

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