Semiconductor device including switching devices in an epitaxial layer
First Claim
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1. A semiconductor device comprising:
- a silicon substrate of one conductivity type;
an epitaxial layer of the one conductivity type provided on the silicon substrate;
a first region of an inverse conductivity type provided on the silicon substrate so as to be in direct contact with both the epitaxial layer and the silicon substrate; and
a plurality of switching devices provided in the epitaxial layer,wherein a first diffusion region of one conductivity type electrically connected to the epitaxial layer is formed in an upper region within the first region opposite from the silicon substrate, whereinan electrode layer which makes ohmic contact with the epitaxial layer is formed above the epitaxial layer,the electrode layer extends to reach, and makes ohmic contact with, the first diffusion region electrically connected to the epitaxial layer, andthe epitaxial layer and the first diffusion region are electrically connected to each other via the electrode layer.
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Abstract
A semiconductor device includes switching devices in an epitaxial layer on a silicon substrate. Diffusion regions of different conductivity types are provided. In some instances, an electrode layer makes ohmic contact with the epitaxial layer and extends to, and makes ohmic contact with, a diffusion region electrically connected to the epitaxial layer. In some instances, diffusion regions of different conductivity types are arranged alternately one by one outward away from the epitaxial layer side.
26 Citations
15 Claims
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1. A semiconductor device comprising:
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a silicon substrate of one conductivity type; an epitaxial layer of the one conductivity type provided on the silicon substrate; a first region of an inverse conductivity type provided on the silicon substrate so as to be in direct contact with both the epitaxial layer and the silicon substrate; and a plurality of switching devices provided in the epitaxial layer, wherein a first diffusion region of one conductivity type electrically connected to the epitaxial layer is formed in an upper region within the first region opposite from the silicon substrate, wherein an electrode layer which makes ohmic contact with the epitaxial layer is formed above the epitaxial layer, the electrode layer extends to reach, and makes ohmic contact with, the first diffusion region electrically connected to the epitaxial layer, and the epitaxial layer and the first diffusion region are electrically connected to each other via the electrode layer. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor device comprising:
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a silicon substrate of one conductivity type; an epitaxial layer of the one conductivity type provided on the silicon substrate; a first region of an inverse conductivity type provided on the silicon substrate so as to be in direct contact with both the epitaxial layer and the silicon substrate; and a plurality of switching devices provided in the epitaxial layer, wherein a first diffusion region of the one conductivity type electrically connected to the epitaxial layer is formed in an upper region within the first region opposite from the silicon substrate, wherein a plurality of first diffusion regions of the one conductivity type and a plurality of second diffusion regions of the inverse conductivity type are formed in the first region, the plurality of first diffusion regions and the plurality of second diffusion regions are arranged alternately one by one from an epitaxial layer side outward away from the epitaxial layer side, with one of the first diffusion regions located at an innermost position closest to the epitaxial layer, and the first diffusion region located at the innermost position is the first diffusion region electrically connected to the epitaxial layer. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification