Electromagnetic wave propagation disruption device and method for producing same
First Claim
1. An electromagnetic wave propagation disruption device with a metamaterial structure, comprising:
- a plurality of conductive elements separated from each other and arranged on a top face of a substrate;
a plurality of interconnection networks electrically interconnecting at least some of said conductive elements,wherein the interconnection networks are not electrically connected to each other, andwherein at least two of said interconnection networks are dimensioned differently to each other, such that distances between interconnected conductive elements are different from one interconnection network to another interconnection network of said at least two of said interconnection networks, to generate phase shifts between the conductive elements interconnected thereby, different from one of said interconnection networks to said another interconnection network;
a ground plane positioned on a bottom face of the substrate with holes formed in the ground plane; and
a set of metallic vias formed in the substrate and passing through an entire thickness thereof, each of said metallic vias comprising an upper end in contact with one of the conductive elements and a lower end arranged facing one of the holes formed in the ground plane, with no electrical contact with the ground plane but with an electrical contact with one of the interconnection networks.
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Abstract
An electromagnetic wave propagation disruption device with a metamaterial structure including: a plurality of conductive elements arranged on a top face of a substrate; a plurality of interconnection networks electrically interconnecting at least some of these conductive elements, wherein these networks are not electrically connected to each other. At least two of these networks are dimensioned differently to each other, thus involving that distances between interconnected conductive elements are different from one network to another, to generate phase shifts, between the conductive elements interconnected thereby, different from one network to the other. A ground plane with holes is arranged on a bottom face of the substrate and metallic vias are formed in the substrate, each of them including an upper end in contact with a conductive elements and a lower end arranged facing one of the holes of the ground plane, with no electrical contact with the ground plane.
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Citations
15 Claims
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1. An electromagnetic wave propagation disruption device with a metamaterial structure, comprising:
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a plurality of conductive elements separated from each other and arranged on a top face of a substrate; a plurality of interconnection networks electrically interconnecting at least some of said conductive elements, wherein the interconnection networks are not electrically connected to each other, and wherein at least two of said interconnection networks are dimensioned differently to each other, such that distances between interconnected conductive elements are different from one interconnection network to another interconnection network of said at least two of said interconnection networks, to generate phase shifts between the conductive elements interconnected thereby, different from one of said interconnection networks to said another interconnection network; a ground plane positioned on a bottom face of the substrate with holes formed in the ground plane; and a set of metallic vias formed in the substrate and passing through an entire thickness thereof, each of said metallic vias comprising an upper end in contact with one of the conductive elements and a lower end arranged facing one of the holes formed in the ground plane, with no electrical contact with the ground plane but with an electrical contact with one of the interconnection networks. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for producing an electromagnetic wave propagation disruption device with a metamaterial structure, comprising:
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arranging a plurality of conductive elements separated from each other on a top face of a substrate; electrically interconnecting at least some of said conductive elements using a plurality of interconnection networks, said interconnection networks not being electrically connected to each other; dimensioning the interconnection networks, wherein at least two of said interconnection networks are dimensioned differently to each other, such that distances between interconnected conductive elements are different from one interconnection network to another interconnection network of said at least two of said interconnection networks, to generate phase shifts between the conductive elements interconnected thereby, different from one of said interconnection networks to said another interconnection network; arranging a ground plane on a bottom face of the substrate with holes formed in the ground plane; and forming a set of metallic vias in the substrate passing through an entire thickness thereof, each of said metallic vias comprising an upper end in contact with one of the conductive elements and a lower end arranged facing one of the holes formed in the ground plane, with no electrical contact with the ground plane but with an electrical contact with one of the interconnection networks. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification