Top port MEMS microphone package and method

• US 9,420,378 B1
• Filed: 07/12/2010
• Issued: 08/16/2016
• Est. Priority Date: 07/12/2010
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Syed, Ahmer Raza, Kuo, Bob Shih-Wei, Troche, Louis B. Jr.
• Primary Examiner(s): Fletcher, Marlon
• Application Number:
  US12/834,682
• Time in Patent Office: 2,227 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/0127 Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/2823 Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material number or position of ports H04R1/2815; vents in bandpass type enclosures H04R1/2846
• CPC Class Codes: H04R 11/04 Microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 9/08 Microphones

Abstract

A top port MEMS microphone package includes a substrate having a back volume expanding aperture therein. A MEMS microphone electronic component is mounted to the substrate directly above the back volume expanding aperture such that an aperture of the MEMS microphone electronic component is in fluid communication with the back volume expanding aperture. A lid having a lid cavity is mounted to the substrate. The back volume expanding aperture couples the aperture of the MEMS microphone electronic component to the lid cavity. By coupling the lid cavity to the aperture with the back volume expanding aperture, the resulting back volume is essentially the size of the entire top port MEMS microphone package. In this manner, the noise to signal ratio is minimized thus maximizing the sensitivity of the top port MEMS microphone package as well as the range of applications.

Claims

1. An electronic component package comprising:

a substrate comprising a back volume expanding aperture therein;

a Micro Electro Mechanical Systems (MEMS) microphone electronic component with a first surface comprising an aperture and a second surface comprising a diaphragm, said first surface coupled to the substrate above a portion of the back volume expanding aperture; and

a lid comprising a lid cavity, an inner surface of the lid coupled to the second surface of the MEMS microphone electronic component, the back volume expanding aperture directly connecting the aperture of the MEMS microphone electronic component to the lid cavity such that the aperture of the MEMS microphone electronic component is in fluid communication with the lid cavity.

2. The electronic component package of claim 1 wherein a first surface of the diaphragm of the MEMS microphone is in fluid communication with the aperture of the MEMS microphone electronic component, and the lid comprises a top port in fluid communication with a second surface of the diaphragm opposite the first surface of the diaphragm.

3. The electronic component package of claim 2 wherein the diaphragm is exposed directly to the ambient environment through the top port.

4. The electronic component package of claim 2 further comprising an acoustic seal forming a seal between a surface of the MEMS microphone electronic component and the inner surface of the lid, such that no air may flow between the top port and the lid cavity.

5. The electronic component package of claim 4 wherein the back volume expanding aperture comprises a volume within the substrate with its bottom surface comprising a plane parallel to a surface on which the MEMS microphone electronic component is coupled.

6. The electronic component package of claim 4 wherein the substrate further comprises terminals and the MEMS microphone electronic component further comprises bond pads at the surface, the electronic component package further comprising bond wires directly coupling the bond pads to the terminals.

7. The electronic component package of claim 6 wherein the acoustic seal encloses the bond pads and a portion of the bond wires.

8. The electronic component package of claim 4 wherein the acoustic seal prevents sound traveling through the top port from passing between the surface of the MEMS microphone electronic component and the inner surface of the lid.

9. The electronic component package of claim 1 wherein a first portion of the back volume expanding aperture is located directly below the aperture of the MEMS microphone electronic component and a second portion of the back volume expanding aperture extends laterally beyond the MEMS microphone electronic component.

10. The electronic component package of claim 1 further comprising a plurality of MEMS microphone electronic component mounting pads coupling the MEMS microphone electronic component to the substrate above the back volume expanding aperture of the substrate, wherein adjacent ones of the plurality of MEMS microphone electronic component mounting pads are separated from each other by an air gap.

11. The electronic component package of claim 10 wherein each of a plurality of corners of the MEMS microphone electronic component is coupled to a respective one the MEMS microphone electronic component mounting pads.

12. The electronic component package of claim 10 wherein each of the MEMS microphone electronic component mounting pads comprises a respective portion of a metal layer and a respective portion of a solder mask formed on the respective portion of the metal layer.

13. The electronic component package of claim 10 wherein the MEMS microphone electronic component mounting pads comprise areas of a first surface of the substrate outside of the back volume expanding aperture.

14. The electronic component package of claim 10 wherein the MEMS microphone electronic component mounting pads are formed within the back volume expanding aperture.

15. An electronic component package comprising:

a substrate;

a Micro Electro Mechanical Systems (MEMS) microphone electronic component comprising a first surface comprising an aperture and an opposite second surface comprising a diaphragm;

a lid defining a lid cavity, an inner surface of the lid coupled to the second surface of the MEMS microphone electronic component;

MEMS microphone electronic component mounting pads coupling the first surface of the MEMS microphone electronic component to a first surface of the substrate such that a space exists between the first surface of the MEMS microphone electronic component and the first surface of the substrate; and

an adhesive directly attaching the first surface of the MEMS microphone electronic component to the MEMS microphone electronic component mounting pads.

16. The electronic component package of claim 15 wherein the MEMS microphone electronic component mounting pads are protrusions that project above the first surface of the substrate.

17. The electronic component package of claim 15 further comprising an acoustic seal forming a seal between a surface of the MEMS microphone electronic component and the inner surface of the lid.

18. A method of forming an electronic component package comprising:

mounting a first surface of a Micro Electro Mechanical Systems (MEMS) microphone electronic component to a substrate with MEMS microphone electronic component mounting pads, wherein the mounting comprises directly attaching the MEMS microphone electronic component to the MEMS microphone electronic component mounting pads with an adhesive;

applying an acoustic seal to a second surface of the MEMS microphone electronic component around a diaphragm of the MEMS microphone electronic component; and

mounting a lid to the substrate and to the second surface of the MEMS microphone electronic component such that the acoustic seal forms a seal around a top port of the lid and the diaphragm.

19. The method of claim 18 further comprising forming a back volume expanding aperture in the substrate by selectively removing portions of the substrate.

20. The method of claim 18 further comprising forming a back volume expanding aperture in the substrate by punching an opening in a first dielectric layer and mounting the first dielectric layer to a second dielectric layer.