Electronic device, method for manufacturing thereof, and electronic apparatus

• US 9,420,691 B2
• Filed: 02/06/2013
• Issued: 08/16/2016
• Est. Priority Date: 02/09/2012
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Takagi, Shigekazu
• Primary Examiner(s): Nguyen, Hoa C
• Assistant Examiner(s): DEPEW, KEITH A
• Application Number:
  US13/760,702
• Publication Number:
  US 20130206465A1
• Time in Patent Office: 1,287 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2207/095 through the lid
• CPC Class Codes: B81B 2207/096 through the substrate
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 3/0086 Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: H05K 1/162 incorporating printed capacitors

Abstract

An electronic device includes a first member including a reference potential terminal; a second member placed on a first surface of the first member and having conductivity; and a functional element accommodated in a cavity surrounded by the first member and the second member, wherein the second member and the reference potential terminal are electrically connected via a contact portion.

Claims

1. An electronic device comprising:

a first member including a reference potential terminal which is disposed on a side of a first surface of the first member;

a second member placed on the first surface of the first member and having conductivity;

a functional element accommodated in a cavity surrounded by the first member and the second member;

a recess disposed on the side of the first surface of the first member; and

a wiring which connects a contact portion with the reference potential terminal, wherein

the wiring and the contact portion are completely disposed within the recess,

the second member and the reference potential terminal are electrically connected via the contact portion and the wiring, and

the contact portion is disposed on the wiring in the recess so that the wiring, the contact portion, and the second member are laminated from a bottom surface of the recess toward the second member.

2. The electronic device according to claim 1, wherein

the contact portion is disposed integrally with the second member.

3. The electronic device according to claim 1, wherein

a material of the first member is glass,

a material of the second member is silicon, and

the first member and the second member are anodically bonded together.

4. The electronic device according to claim 1, wherein

the functional element is a physical quantity sensor.

5. An electronic apparatus comprising the electronic device according to claim 1.

6. An electronic device comprising:

a first member including a reference potential terminal;

a second member placed on a first surface of the first member and having conductivity;

a functional element accommodated in a cavity surrounded by the first member and the second member; and

a recess disposed in the first surface of the first member, wherein

the second member and the reference potential terminal are electrically connected via a contact portion,

the reference potential terminal is disposed on a second surface, which is opposite to the first surface, of the first member, and

the contact portion and the reference potential terminal are connected via a through-electrode penetrating through the first member wherein

the contact portion is completely disposed within the recess.

7. The electronic device according to claim 6, wherein

the contact portion is disposed integrally with the second member.

8. The electronic device according to claim 6, wherein

a material of the first member is glass,

a material of the second member is silicon, and

the first member and the second member are anodically bonded together.

9. The electronic device according to claim 6, wherein

the functional element is a physical quantity sensor.

10. An electronic device comprising:

a first member including a reference potential terminal which is disposed on a side of a first surface of the first member;

a second member placed on the first surface of the first member and having conductivity;

a functional element accommodated in a cavity surrounded by the first member and the second member;

a recess disposed on the side of the first surface of the first member; and

a wiring which connects a contact portion with the reference potential terminal, wherein

the wiring and the contact portion are completely disposed within the recess,

the second member and the reference potential terminal are electrically connected via the contact portion and the wiring,

the contact portion is disposed on the wiring in the recess so that the wiring, the contact portion, and the second member are laminated from a bottom surface of the recess toward the second member, and

the reference potential terminal is electrically connected with the functional element through the wiring.

11. The electronic device according to claim 10, wherein

the contact portion is disposed integrally with the second member.

12. The electronic device according to claim 10, wherein

a material of the first member is glass,

a material of the second member is silicon, and

the first member and the second member are anodically bonded together.

13. The electronic device according to claim 10, wherein

the functional element is a physical quantity sensor.