Connection using conductive vias

• US 9,420,704 B2
• Filed: 07/31/2014
• Issued: 08/16/2016
• Est. Priority Date: 02/25/2011
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Inventors: Morris, Thomas Scott, Madsen, Ulrik Riis, Leahy, Donald Joseph
• Primary Examiner(s): Wilson, Allan R
• Application Number:
  US14/447,847
• Publication Number:
  US 20140340859A1
• Time in Patent Office: 747 Days
• Field of Search: 257/659, 257/660, 257/E23.114, 257/E21.502, 438/121, 438/124
• US Class Current: 1/1
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence
• CPC Class Codes: H05K 9/0024 Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a conductive vertical interconnect access structure (vias) associated with each component area to be shielded is then exposed through the body by a cutting, drilling, or similar operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed conductive vias.

Claims

1. An electronic module, comprising:

a substrate comprising a component portion wherein the component portion includes a component area on a surface of the substrate, more than two metallic layers that extend along a periphery of the component portion and a first conductive vertical interconnect access structure (via) attached to the more than two metallic layers at the periphery of the component portion such that the more than two metallic layers and the first conductive via are configured to provide electromagnetic shielding;

an electronic component on the component area;

an overmold formed over the component area, the overmold forming an opening through which the first conductive via extends such that the first conductive via extends above an upper surface of the overmold; and

an electromagnetic shield formed over the overmold and directly attached to the first conductive via.

2. The electronic module of claim 1, wherein the first conductive via comprises a conductive bar.

3. The electronic module of claim 1, wherein the first conductive via extends above the surface.

4. The electronic module of claim 3, wherein one of the more than two metallic layers are positioned on the surface of the substrate along a perimeter of the component area.

5. The electronic module of claim 1, wherein the first conductive via is coupled to ground.

6. The electronic module of claim 1, wherein the more than two metallic layers that extend along the periphery of the component portion comprise a first metallic layer and a second metallic layer positioned below the first metallic layer, the first conductive via being attached to the second metallic layer.

7. The electronic module of claim 1, further comprising:

a first metallic layer of the more than two metallic layers substantially surrounding the periphery of the component portion;

a first plurality of conductive vias attached to the first metallic layer that substantially surround the periphery of the component portion, wherein the first plurality of conductive vias include the first conductive via; and

the electromagnetic shield being directly attached to at least a section of each of the first plurality of conductive vias which includes at least a section of the first conductive via.

8. The electronic module of claim 7, further comprising:

a second metallic layer of the more than two metallic layers within the substrate that substantially surrounds the periphery of the component portion and is positioned below the first metallic layer; and

a second plurality of conductive vias that substantially surround the periphery of the component portion, each of the second plurality of conductive vias being attached between the first and second metallic layers.