Double anodizing processes

• US 9,420,713 B2
• Filed: 09/11/2012
• Issued: 08/16/2016
• Est. Priority Date: 05/29/2012
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Browning, Lucy Elizabeth, Woodhull, Charles B., Kiple, Bryan Patrick, Pakula, David A., Tan, Tang Yew, Hanchak-Connors, Julie, Thornton, John Murray III, Johannessen, Thomas, Russell-Clarke, Peter, Tatebe, Masashige, Tan, Napthaneal Y.
• Primary Examiner(s): Katz, Vera
• Application Number:
  US13/610,813
• Publication Number:
  US 20130319865A1
• Time in Patent Office: 1,435 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B23C 2220/04 Milling with the axis of the cutter inclined to the surface being machined
• CPC Class Codes: B23C 2220/16 Chamferring
• CPC Class Codes: B23C 2220/20 Deburring
• CPC Class Codes: B23C 2220/28 Finishing roughing and finishing B23C2220/605
• CPC Class Codes: B23C 2220/48 Methods of milling not otherwise provided for
• CPC Class Codes: B23C 2226/31 Diamond
• CPC Class Codes: B23C 2226/315 polycrystalline [PCD]
• CPC Class Codes: B23C 5/00 Milling-cutters for cutting gear-teeth B23F21/12
• CPC Class Codes: B23C 5/1081 with permanently fixed cutting inserts B23C5/1018 and B23C5/1063 take precedence
• CPC Class Codes: B23P 11/00 Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for connecting sheet metal or metal tubes, rods or profiles B21D39/00; riveting B21J; soldering, unsoldering, welding B23K; hand tools for connecting wire or strip B25B25/00; connecting metal parts by adhesives F16B11/00
• CPC Class Codes: B23P 17/00 Metal-working operations, not covered by a single other subclass or another group in this subclass
• CPC Class Codes: B23P 17/02 Single metal-working processes; Machines or apparatus therefor
• CPC Class Codes: C25D 11/02 Anodisation
• CPC Class Codes: C25D 11/022 Anodisation on selected surface areas
• CPC Class Codes: C25D 11/12 Anodising more than once, e.g. in different baths
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: C25D 11/34 of metals or alloys not provided for in groups C25D11/04 - C25D11/32
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/42 Housings not intimately mechanically associated with radiating elements, e.g. radome
• CPC Class Codes: H04M 1/0249 : Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0254 : comprising one or a plurality of mechanically detachable modules
• CPC Class Codes: H04M 1/11 : Supports for sets, e.g. incorporating armrests
• CPC Class Codes: H05K 13/00 : Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 5/02 : Details
• CPC Class Codes: H05K 5/0217 : Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0243 : for decorative purposes
• CPC Class Codes: H05K 5/0247 : Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/03 : Covers
• CPC Class Codes: H05K 5/04 : Metal casings
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1064 : Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 29/47 : Burnishing
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 407/1906 : including holder [i.e., head] having seat for inserted tool
• CPC Class Codes: Y10T 409/300896 : with sensing of numerical information and regulation without mechanical connection between sensing means and regulated means [i.e., numerical control]
• CPC Class Codes: Y10T 409/303752 : Process
• CPC Class Codes: Y10T 409/30952 : with cutter holder

Abstract

Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.

Claims

1. A consumer electronic product, comprising:

a housing having a bottom portion defining a first surface and a side wall defining a second surface, the first surface non-parallel to the second surface, wherein the first surface and second surface meet at a chamfered edge, the chamfered edge defining a chamfer surface disposed between the first surface and the second surface, wherein the first surface and the second surface are textured surfaces and the chamfer surface is a mirror reflective surface;

a primary anodization layer disposed on the first surface and the second surface; and

a secondary anodization layer disposed on the chamfer surface.

2. The consumer electronic product as recited in claim 1, wherein the first surface and second surface are blasted surfaces.

3. The consumer electronic product as recited in claim 2, wherein the secondary anodization layer has a different pore density than the primary anodization layer.

4. The consumer electronic product as recited in claim 3, wherein secondary anodization layer has a different average pore size than the primary anodization layer.

5. The consumer electronic product as recited in claim 4, wherein the primary anodization layer includes a first portion and a second portion, wherein a first angle between an edge of the first portion and the secondary anodization layer is about equal to a second angle between an edge of the second portion and the secondary anodization layer.

6. The consumer electronic product as recited in claim 1, wherein a thickness of the primary anodization layer is about the same as a thickness of the secondary anodization layer.

7. The consumer electronic product as recited in claim 1, wherein the secondary anodization layer is characterized as having a first pore density and a first average pore size and wherein the primary anodization layer is characterized as having a second pore density and a second average pore size.

8. The consumer electronic product as recited in claim 7, wherein the first pore density is greater than the second pore density and the first average pore size is less than the second average pore size.

9. A housing for a consumer electronic product, the housing comprising:

a protective coating covering a chamfered edge of the housing, the chamfered edge comprising a chamfer surface positioned between a first surface and a second surface, wherein the first surface and the second surface are textured surfaces and the chamfer surface is a mirror reflective surface;

the first surface non-parallel to the second surface, the protective coating comprising;

a primary anodization layer covering the first surface and the second surface, and

a secondary anodization layer covering the chamfer surface.

10. The housing of claim 9, wherein a difference in a thickness of the primary anodization layer and a thickness of the secondary anodization layer is about 5 microns or less.

11. The housing of claim 9, wherein the first surface and the second surface are characterized as blasted surfaces and the chamfer surface is a polished surface.

12. The housing of claim 9, wherein the chamfered edge includes a highlighted portion, the highlighted portion characterized as a polished surface portion of at least one of the first surface or the second surface.

13. The housing of claim 9, wherein the secondary anodization layer has a different pore density than the primary anodization layer.