Liquid-cooled heat sink assemblies
First Claim
1. A method comprising:
- providing a liquid-cooled heat sink assembly to cool at least one component, the providing the liquid-cooled heat sink assembly comprising;
providing a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface to couple to the at least one component to be cooled;
providing a manifold structure attached to the thermally conductive base structure, with the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and
providing a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure.
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Accused Products
Abstract
Liquid-cooled heat sink assemblies are provided which include: a thermally conductive base structure having a sidewall surface and a main heat transfer surface; and a manifold structure attached to the base structure, with the base structure residing at least in part within a recess in the manifold structure. Together, the base and manifold structures define a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the base structure, and at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure includes a continuous groove. A sealing member is disposed, at least in part, within the continuous groove, and provides a fluid-tight seal between the thermally conductive base structure and the manifold structure.
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Citations
12 Claims
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1. A method comprising:
providing a liquid-cooled heat sink assembly to cool at least one component, the providing the liquid-cooled heat sink assembly comprising; providing a thermally conductive base structure having a sidewall surface and a main heat transfer surface, the main heat transfer surface to couple to the at least one component to be cooled; providing a manifold structure attached to the thermally conductive base structure, with the thermally conductive base structure residing at least partially within a recess in the manifold structure, the manifold structure and the thermally conductive base structure together defining a coolant-carrying compartment through which liquid coolant flows, at least in part, in a direction substantially parallel to the main heat transfer surface of the thermally conductive base structure, wherein at least one of the sidewall surface of the thermally conductive base structure or an opposing surface thereto of the manifold structure comprises a continuous groove; and providing a sealing member disposed, at least in part, within the continuous groove, the sealing member providing a fluid-tight seal between the thermally conductive base structure and the manifold structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
Specification