Heat spreading device and method with sectioning forming multiple chambers

• US 9,423,192 B2
• Filed: 11/18/2011
• Issued: 08/23/2016
• Est. Priority Date: 05/18/2009
• Status: Active Grant

• Current Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Tsoi, Vadim, Henningsson, Uno, Hong, Yuping, Peng, Feng, Yang, Hua, Li, Haipeng
• Primary Examiner(s): CIRIC, LJILJANA V
• Application Number:
  US13/299,431
• Publication Number:
  US 20120111553A1
• Time in Patent Office: 1,740 Days
• Field of Search: 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/130, 165/131, 165/104.21, 165/104.26, 165/104.33, 165/166, 165/170, 165/185, 165/129, 361/699, 361/700, 298/900.3, 298/900.32, 298/900.35
• US Class Current: 1/1
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28F 13/06 by affecting the pattern of flow of the heat-exchange media F28F13/003 takes precedence; static flow control means in header boxes F28F9/026
• CPC Class Codes: F28F 21/084 from aluminium or aluminium alloys
• CPC Class Codes: F28F 3/048 in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20245 by natural convection; Thermosiphons
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps
• CPC Class Codes: Y10T 29/4935 Heat exchanger or boiler making

Abstract

A heat spreading device includes sectioning forming a first chamber portion and a second chamber portion, a first plurality of conduits, and a second at least two conduits. The second at least two conduits interconnect the first chamber portion and the second chamber portion. The heat spreading device may also include cavities, a barrier, and fins.

Claims

1. A thermo siphon heat spreading device comprising:

a first chamber portion formed within the thermo siphon heat spreading device;

a second chamber portion formed within the thermo siphon heat spreading device;

a first plurality of channels disposed within the first chamber portion, wherein all of the first plurality of channels are parallel to each other;

a second plurality of channels disposed within the second chamber portion, wherein all of the second plurality of channels are parallel to each other, wherein the first chamber portion and the first plurality of channels form an evaporator, wherein the second chamber portion and the second plurality of channels form a condenser; and

a sectioning structure that is configured to separate the first chamber portion from the second chamber portion such that fluid in a gas phase can be passed from the evaporator to the condenser through a riser which connects the evaporator and the condenser and fluid in a liquid phase can be passed from the condenser to the evaporator through a downcomer which connects the evaporator and the condenser, wherein the sectioning structure has a portion that forms the riser and is adjacent to and parallel to the second plurality of channels, wherein the sectioning structure has another portion that forms the downcomer and is adjacent to and parallel to the first plurality of channels, wherein the riser is the only riser in the thermo siphon heat spreading device, and wherein the downcomer is the only downcomer in the thermo siphon heat spreading device.

2. The thermo siphon heat spreading device according to claim 1, further comprising two plates, wherein the two plates comprise copper or aluminium, and wherein the two plates are connected by welding.

3. The thermo siphon heat spreading device according to claim 1, further comprising fins or ribs on an outer surface of the device.

4. The thermo siphon heat spreading device according to claim 1, further comprising a first outer surface and a second outer surface, wherein the first chamber portion and the second chamber portion are disposed between the first outer surface and the second outer surface, wherein the first outer surface is configured to receive heat from a heat source, and wherein the second outer surface is configured to dissipate the heat.

5. The thermo siphon heat spreading device according to claim 4, wherein the first outer surface and the second outer surface are parallel, wherein the first outer surface is planar, and wherein a portion of the second outer surface comprises fins or ribs.

6. The thermo siphon heat spreading device according to claim 1, further comprising a first outer sidewall and a second outer sidewall, wherein the first outer sidewall and the second outer sidewall are parallel, and wherein the first chamber portion and the second chamber portion are disposed between the first outer sidewall and the second outer sidewall.

7. The thermo siphon heat spreading device according to claim 6, wherein the first plurality of channels, the second plurality of channels, the first conduit, and the second conduit are parallel to the first Outer sidewall and the second outer sidewall.

8. The thermo siphon heat spreading device according to claim 1, further comprising an outer surface, wherein the outer surface comprises a plurality of sides, and wherein only one of the plurality of sides comprises fins or ribs disposed thereon.

9. The thermo siphon heat spreading device according to claim 1, further comprising an aperture extending between an outer surface of the heat spreading device and an inner surface of the evaporator, and wherein the aperture is configured to receive the fluid to fill the heat spreading device.

10. The thermo siphon heat spreading device of claim 1, wherein the heat spreading device comprises a housing formed by a cover portion, a bottom portion, two end walls, and two side walls, and wherein the first plurality of channels and the second plurality of channels are parallel to the two side walls and are perpendicular to the respective two end walls.

11. The thermo siphon heat spreading device of claim 1, wherein the sectioning structure is also configured to guide the fluid in the gas phase from the evaporator to the riser, and to guide the fluid in the liquid phase from the condenser to the downcomer.

12. The thermo siphon heat spreading device of claim 1, wherein the sectioning structure comprises a structure that is positioned substantially in the center of the device, and wherein the structure starts at a middle-left-down corner of the device and extends to and ends at a middle-right-up corner of the device.

13. The thermo siphon heat spreading device of claim 1, wherein the evaporator and the condenser are formed in a block having an extruded profile.

14. A thermo siphon heat spreading device comprising:

an evaporator comprising a first chamber portion and a first plurality of channels, wherein the first chamber portion is formed within the thermo siphon heat spreading device, wherein the first plurality of channels are disposed within the first chamber portion, and wherein all of the first plurality of channels are parallel to each other;

a condenser comprising a second chamber portion and a second plurality of channels, wherein the second chamber portion is formed within the thermo siphon heat spreading device, wherein the second plurality of channels are disposed within the second chamber portion, and wherein all of the second plurality of channels are parallel to each other; and

a sectioning structure that is configured to separate the first chamber portion from the second chamber portion such that fluid in a gas phase can be passed from the evaporator to the condenser through a riser which connects the evaporator and the condenser and fluid in a liquid phase can be passed from the condenser to the evaporator through a downcomer which connects the evaporator and the condenser, wherein the sectioning structure has a portion that forms the riser and is adjacent to and parallel to the second plurality of channels, wherein the sectioning structure has another portion that forms the downcomer and is adjacent to an parallel to the first plurality of channels, wherein the riser is the only riser in the thermo siphon heat spreading device, and wherein the downcomer is the only downcomer in the thermo siphon heat spreading device.

15. The thermo siphon heat spreading device according to claim 14, further comprising a first outer surface and a second outer surface, wherein the first outer surface forms a part of the evaporator and a part of the condenser, and wherein the second outer surface forms another part of the evaporator and another part of the condenser.

16. The thermo siphon heat spreading device according to claim 15, wherein the first outer surface is planar and is configured to receive heat from a heat source, and wherein the second outer surface is configured to dissipate the heat.

17. The thermo siphon heat spreading device according to claim 16, wherein only a portion of the second outer surface that is adjacent to the evaporator comprises ribs or fins disposed thereon.

18. The thermo siphon heat spreading device of claim 14, wherein the riser is formed adjacent to one lateral side of the device, and the downcomer is formed adjacent to the other lateral side of the device.

19. The thereto siphon heat spreading device of claim 14, wherein the sectioning structure comprises a structure that is positioned substantially in the center of the device, and wherein the structure starts at a middle-left-down corner of the device and extends to and ends at a middle-right-up corner of the device.

20. The thermo siphon heat spreading device of claim 14, wherein the evaporator and the condenser are formed in a block having an extruded profile.