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Dual interface IC card components and method for manufacturing the dual-interface IC card components

  • US 9,424,507 B2
  • Filed: 04/01/2014
  • Issued: 08/23/2016
  • Est. Priority Date: 04/01/2014
  • Status: Active Grant
First Claim
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1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

  • obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

    attaching at least one A-shaped antenna contact lead to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card, wherein the at least one A-shaped antenna contact lead is removed out of a sheet of conductive material.

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