Dual interface IC card components and method for manufacturing the dual-interface IC card components

• US 9,424,507 B2
• Filed: 04/01/2014
• Issued: 08/23/2016
• Est. Priority Date: 04/01/2014
• Status: Active Grant

• Current Assignee: NXP B.V. (NXP Semiconductors NV)
• Original Assignee: NXP B.V. (NXP Semiconductors NV)
• Inventors: Zenz, Christian, Kamphuis, Tonny, van Rijckevorsel, Johannes Wilhelmus, Kasemset, Bodin, Ceccarelli, David, van Blokland, Boudewijn, Schoengrundner, Patrick
• Primary Examiner(s): Kim, Ahshik
• Application Number:
  US14/242,031
• Publication Number:
  US 20150278673A1
• Time in Patent Office: 875 Days
• Field of Search: 235/492, 235/451, 235/488, 340/572.7, 340/572.8
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: G06K 19/07769 the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: Y10T 29/49018 with other electrical component

Abstract

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Claims

1. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact base structure, wherein the single-sided contact base structure comprises a substrate with an electrical contact layer; and

attaching at least one A-shaped antenna contact lead to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card, wherein the at least one A-shaped antenna contact lead is removed out of a sheet of conductive material.

2. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises:

picking up an antenna contact lead; and

placing the antenna contact lead on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.

3. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises:

applying an adhesive material to the substrate of the single-sided contact base structure; and

placing an antenna contact lead on the applied adhesive material to attach the antenna contact lead to the single-sided contact base structure.

4. The method of claim 3, wherein applying the adhesive material to the substrate comprises dispensing glue onto the substrate.

5. The method of claim 3, further comprising curing the adhesive material.

6. The method of claim 1, wherein attaching the at least one antenna contact lead to the single-sided contact base structure comprises:

applying an adhesive material to an antenna contact lead; and

placing the antenna contact lead with the applied adhesive material on the single-sided contact base structure to attach the antenna contact lead to the single-sided contact base structure.

7. The method of claim 1, wherein the contact layer is attached to a first side of the substrate, and wherein the at least one antenna contact lead is attached to a second, opposite, side of the substrate.

8. The method of claim 1, further comprising obtaining the at least one antenna contact lead by punching, etching or laser cutting the sheet of conductive material.

9. The method of claim 1, wherein the at least one antenna contact lead is applied to the single-sided contact base structure in a reel-to-reel process.

10. The method of claim 1, wherein the at least one antenna contact lead is crimped or has a spring like feature.

11. The method of claim 1, wherein obtaining the single-sided contact base structure comprises obtaining a single-sided contact tape.

12. The method of claim 1, wherein the at least one antenna contact lead is electrically connected to an antenna located on the substrate.

13. The method of claim 1, further comprising attaching an IC chip, bond wires and an encapsulation to the dual-interface contact structure to produce a dual-interface IC chip module.

14. A method for manufacturing a dual-interface integrated circuit (IC) card component, the method comprising:

obtaining a single-sided contact tape that contains at least one column of single-sided base structures, wherein the single-sided contact tape comprises a substrate with an electrical contact layer;

applying an adhesive material to the substrate of the single-sided contact tape;

removing a plurality of A-shaped antenna contact leads out of a sheet of conductive material; and

attaching the A-shaped antenna contact leads to the single-sided contact tape using the applied adhesive material to form dual-interface contact structures.

15. The method of claim 14, wherein obtaining the plurality of antenna contact leads comprises punching the antenna contact leads out of a sheet of conductive material.

16. The method of claim 14, further comprising:

attaching an IC chip, bond wires and an encapsulation to each of the dual-interface contact structures to produce dual-interface IC chip modules.

17. The method of claim 14, wherein applying the adhesive material to the substrate comprises dispensing glue onto the substrate.

18. The method of claim 14, further comprising curing the adhesive material.

19. A dual-interface integrated circuit (IC) card component, the dual-interface IC card component comprising:

a substrate;

an electrical contact layer attached to a first side of the substrate, the electrical contact layer comprising a contact plate and a plurality of grooves; and

at least one A-shaped antenna contact lead glued to a second, opposite, side of the substrate, wherein the at least one A-shaped antenna contact lead is removed out of a sheet of conductive material.

20. The dual-interface IC card component of claim 19, further comprising:

an IC chip attached to the substrate;

bond wires electrically connected to the IC chip, the electrical contact layer and the at least one antenna contact lead; and

an encapsulation over the IC chip.