Thin film coil, shield part including the same, and contactless power transmission device having the shield part

• US 9,424,983 B2
• Filed: 05/16/2013
• Issued: 08/23/2016
• Est. Priority Date: 03/13/2013
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Choi, Kang Ryong, An, Sung Yong, Yeo, Jeong Gu, Jung, Chang Ryul
• Primary Examiner(s): Fleming, Fritz M
• Application Number:
  US13/895,608
• Publication Number:
  US 20140265612A1
• Time in Patent Office: 1,195 Days
• Field of Search: 307/104, 336/200, 336/206
• US Class Current: 1/1
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/36 Electric or magnetic shields or screens movable for varying inductance H01F21/10
• CPC Class Codes: H01F 27/366 made of ferromagnetic material
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H01F 5/04 Arrangements of electric connections to coils, e.g. leads
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H02J 50/12 of the resonant type

Abstract

There is provided a thin film coil, including a thin type coil pattern, and a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.

Claims

1. A thin film coil, comprising:

a thin type coil pattern; and

a coil lead-out portion including a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.

2. The thin film coil of claim 1, further comprising an insulation layer formed between the coil pattern and the lead-out line.

3. The thin film coil of claim 1, wherein the conductive adhesive layer is at least one selected from a group consisting of an anisotropic conductive film, a conductive polymer and a conductive metal.

4. The thin film coil of claim 1, wherein a thickness of the conductive adhesive layer is 5 to 30 μ

m.

5. The thin film coil of claim 1, wherein a thickness of the coil pattern is 5 to 95 μ

m.

6. A shield part, comprising:

at least one or more magnetic sheets stacked on one another;

a coil pattern formed on the magnetic sheets, at least one of the magnetic sheets having a groove formed in one surface or a through hole formed therein; and

a coil lead-out portion embedded in the groove or through hole of the magnetic sheet,

wherein the coil lead-out portion includes a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.

7. The shield part of claim 6, wherein the magnetic sheets include first to n^th magnetic sheets layered from top to bottom, and the first magnetic sheet has the groove or through hole formed therein.

8. The shield part of claim 6, wherein the magnetic sheets include first to n^th magnetic sheets layered from top to bottom, conductive vias in the first to (n−

1)^th magnetic sheets are filled with conductive material, the conductive vias electrically connect the central portion of the coil pattern to the conductive adhesive layer, and the n^th magnetic sheet has the groove or though hole formed therein.

9. The shield part of claim 6, wherein the magnetic sheets include first to n^th magnetic sheets layered from top to bottom, conductive vias in the first to (m−

1)^th magnetic sheets (m<

n) are filled with conductive material, the conductive vias electrically connect the central portion of the coil pattern to the conductive adhesive layer, and the m^th magnetic sheet has the groove or though hole formed therein.

10. The shield part of claim 6, wherein the conductive adhesive layer is at least one selected from a group consisting of an anisotropic conductive film, a conductive polymer and a conductive metal.

11. The shield part of claim 6, wherein a thickness of the conductive adhesive layer is 5 to 30 μ

m.

12. A contactless power transmission device, comprising:

a shield part;

a lead-out pad electrically connected to a lead-out line;

a distal contact pad electrically connected to an externally exposed end of a coil pattern; and

a power supply unit inputting and outputting power to the lead-out pad and the distal contact pad,

wherein the shield part includes;

at least one or more magnetic sheets stacked on one another and a coil pattern formed on the magnetic sheets, at least one of the magnetic sheets having a groove formed in one surface thereof or a through hole formed therein, and a coil lead-out portion embedded in the groove or through hole of the magnetic sheets, wherein the coil lead-out portion includes a lead-out line traversing the coil pattern from a central portion thereof and electrically connecting the central portion of the coil pattern to the outside thereof, and a conductive adhesive layer electrically connecting the central portion of the coil pattern to the lead-out line.