Light emitting device

• US 9,425,236 B2
• Filed: 03/31/2015
• Issued: 08/23/2016
• Est. Priority Date: 01/22/2010
• Status: Active Grant

• Current Assignee: Heavy Duty Lighting LLC (Ni, Wang & Massand, PLLC)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hata, Toshio, Ishizaki, Shinya, Agatani, Makoto, Nada, Tomokazu
• Primary Examiner(s): TRAN, MINH LOAN
• Application Number:
  US14/674,624
• Publication Number:
  US 20150207048A1
• Time in Patent Office: 511 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/238 Arrangement or mounting of circuit elements integrated in the light source
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21V 5/048 the lens being a simple lens adapted to cooperate with a point-like source for emitting mainly in one direction and having an axis coincident with the main light transmission direction, e.g. convergent or divergent lenses, plano-concave or plano-convex lenses
• CPC Class Codes: F21V 5/10 comprising photoluminescent material
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/54 : having a particular shape
• CPC Class Codes: H01L 33/56 : Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 : Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes: a ceramic substrate; a plurality of LED chips; a printed resistor(s) connected in parallel with the plurality of LED chips; a dam resin made of a resin having a low optical transmittance; a fluorescent-material-containing resin layer; and an anode-side electrode and a cathode-side electrode, (a) which are provided on a primary surface of the ceramic substrate so as to face each other along a first direction on the primary surface and (b) which are disposed below at least one of the dam resin and the fluorescent-material-containing resin layer. With the configuration in which a plurality of LEDs, which are connected in a series-parallel connection, are provided on a substrate, it is possible to provide a light emitting device which can achieve restraining of luminance unevenness and an improvement in luminous efficiency.

Claims

1. A light emitting device comprising:

a ceramic substrate having a primary surface;

a plurality of LED chips positioned around a center of the primary surface of said substrate;

a plurality of wires for connecting the plurality of LED chips with each other, each of said plurality of wires being directly connected between two of the plurality of LED chips;

a resin frame formed on the primary surface of said substrate and provided annularly so as to surround a mounting area in which the plurality of LED chips are provided, said resin frame having light reflectivity, and wherein the resin frame has a circular shape in a top view and a dome shape in a cross-sectional view;

a sealing resin provided on the mounting area and inside said resin frame, and wherein the top of said sealing resin is higher than the top of said resin frame;

an anode-side electrode land and a cathode-side electrode land which are electrodes to be connected to an external voltage supply, and are electrically connected to the plurality of LED chips, said anode-side electrode land and said cathode-side electrode land being provided on the primary surface of said substrate and outside said resin frame; and

an electrode wiring pattern on the primary surface of the substrate including (i) an anode pattern extending from the anode-side electrode land to a portion under said resin frame, and (ii) a cathode pattern extending from the cathode-side electrode land to the other portion under the resin frame, so as to electrically connect the plurality of LED chips to the anode-side electrode land and the cathode-side electrode land.

2. The light emitting device of claim 1, wherein said substrate has a rectangular shape in a top view.

3. The light emitting device of claim 1, wherein said substrate has a longer side of 15 mm and a shorter side of 12 mm.

4. The light emitting device of claim 2, wherein said anode-side electrode land and said cathode-side electrode land are located near corners of said substrate.

5. The light emitting device of claim 4, wherein said anode-side electrode land is opposite to said cathode-side electrode land with respect to said sealing resin.

6. The light emitting device of claim 1, wherein said sealing resin contacts said resin frame.

7. The light emitting device of claim 6, wherein said anode-side electrode land is opposite to said cathode-side electrode land with respect to said sealing resin.

8. The light emitting device of claim 1, wherein said sealing resin has a dome shape that projects upward in a cross sectional view.

9. The light emitting device of claim 1, further comprising:

an anode-side conductive pattern having a portion located under said resin frame; and

a cathode-side conductive pattern having a portion located under said resin frame,

wherein said anode-side electrode land is electrically connected to the plurality of LED chips via said anode-side conductive pattern, and said cathode-side electrode land is electrically connected to the plurality of LED chips via said cathode-side conductive pattern.

10. The device of claim 9, wherein the plurality of LED chips mounted between the anode-side conductive pattern and the cathode-side conductive pattern, and the plurality of LED chips are located apart from each of the anode-side conductive pattern and the cathode-side conductive pattern.

11. The light emitting device of claim 1, further comprising:

a conductive pattern provided on the primary surface of said substrate; and

an end wire connected between one of the plurality of LED chips and said conductive pattern, and longer than one of said plurality of wires that connects said one of the plurality of LED chips.

12. The device of claim 1, wherein:

said anode pattern has a width narrower than that of said anode-side electrode land; and

said cathode pattern has a width narrower than that of said cathode-side electrode land.

13. The device of claim 1, wherein said anode pattern further extends to the mounting area.

14. The device of claim 1, wherein said cathode pattern further extends to the mounting area.

15. The device of claim 1, wherein said anode and cathode patterns are line pattern.

16. The device of claim 1, further comprising:

a conductive pattern provided on the primary surface of said substrate; and

an end wire connected between one of the plurality of LED chips and said conductive pattern, and a portion of said end wire being covered by said resin frame.