Wireless module with integrated antenna by using rigid-flex board

• US 9,425,502 B2
• Filed: 02/27/2014
• Issued: 08/23/2016
• Est. Priority Date: 10/31/2013
• Status: Active Grant

• Current Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chen, Hsin-Hong, Shih, Ruei-Kun, Liu, Echan
• Primary Examiner(s): Nguyen, Hoang V
• Assistant Examiner(s): TRAN, HAI V
• Application Number:
  US14/191,992
• Publication Number:
  US 20150116156A1
• Time in Patent Office: 908 Days
• Field of Search: 343/700.MS, 343/702
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them

Abstract

A wireless module includes a flex substrate, an antenna integrated in the flex substrate and electrically connected to a signal layer and a ground layer of the flex substrate, a first rigid substrate stacked on one side of the flex substrate remote from the antenna, and a communication unit mounted on the first rigid substrate and electrically connected to the signal layer. Thus, the flex substrate and the first rigid substrate are laminated into a Rigid-Flex board. Further, the signal layer and the ground layer are continuously arranged in the same flex substrate. It will be helpful in decreasing the uncertainty and loss of RF signal transmission path, reducing component costs, facilitating optimization of the antenna and reducing the module size.

Claims

1. A wireless module with integrated antenna by using rigid-flex board, comprising:

a flex substrate comprising opposing first surface and second surface, a signal layer and a ground layer;

an antenna integrated in one side of said flex substrate, said antenna comprising a radiator and a feed-in segment and a grounding segment extended from said radiator and respectively electrically connected to said signal layer and said ground layer;

a first rigid substrate directly stacked on at least a part of said first surface of said flex substrate at an opposite side remote from said antenna; and

a communication unit integrated in said first rigid substrate and electrically connected to said signal layer;

wherein said antenna and said signal layer are located on said first surface.

2. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1, wherein said ground layer is located on said second surface.

3. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1, wherein said communication unit comprises at least one communication IC.

4. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3, wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of SiP (System in Package).

5. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3, wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of MCP (Multi-Chip Package).

6. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3, wherein each said communication IC is packaged on said first rigid substrate using the semiconductor packaging technique of PoP (Package on Package).

7. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 3, further comprising a second rigid substrate stacked on said second surface.

8. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1, wherein said antenna is selected from the group of planar inverted-F antenna, near-field communication antenna, monopole antenna and dipole antenna.

9. The wireless module with integrated antenna by using rigid-flex board as claimed in claim 1, further comprising a grounding component, said grounding component comprising a conducting structure connected to the connection between said ground layer of said flex substrate and said grounding segment of said antenna.