Module, electronic apparatus and moving object

• US 9,426,892 B2
• Filed: 02/19/2014
• Issued: 08/23/2016
• Est. Priority Date: 03/01/2013
• Status: Active Grant

• Current Assignee: 138 East LCD Advancements Limited (Vector Capital Corporation)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kobayashi, Tomonaga
• Primary Examiner(s): Smith, Courtney
• Assistant Examiner(s): Morrison, Rashen E
• Application Number:
  US14/183,970
• Publication Number:
  US 20140247565A1
• Time in Patent Office: 916 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: G01C 19/5733 Structural details or topology
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H05K 1/00 Printed circuits
• CPC Class Codes: H05K 3/00 Apparatus or processes for manufacturing printed circuits

Abstract

A module includes an insulating substrate that is a first base material; a cover member having a cavity section and a second recess section that form an internal space between the cover member and the insulating substrate, which is a second base material bonded to the insulating substrate on a first surface thereof; an element piece that is a first functional element, accommodated in the internal space; a recess section formed on a second surface that is a rear surface of the first surface of the cover member; and a semiconductor device that is a second functional element, connected in the recess section.

Claims

1. A module comprising:

a first base that has a first recess in a top surface of the first base;

a second base that is provided over the first base, the second base having second and third recesses in top and bottom surfaces thereof, respectively;

a first functional element that is accommodated in an internal space, which is provided by the first and third recesses, at least a part of the first functional element being surrounded by the first base and the second base; and

a second functional element that is mounted in a bottom surface of the second recess, wherein

the third recess is larger than the first recess in a plan view,

the first base is larger than the second base in the plan view, and

the first functional element is a physical quantity sensor having movable and fixed electrodes, and the movable electrodes are completely enclosed by an outer edge of the first recess in the plan view.

2. The module according to claim 1,

wherein the second functional element is connected to the bottom surface of the second recess by a bonding material.

3. The module according to claim 1,

wherein the second recess has a side wall, and a part of a periphery of the second functional element is laterally shifted from the side wall in the plan view.

4. The module according to claim 2,

wherein the second recess has a side wall, and a part of a periphery of the second functional element is laterally shifted from the side wall in the plan view.

5. The module according to claim 1, further comprising:

a base substrate,

wherein the first base is mounted over the base substrate.

6. The module according to claim 5,

wherein the second functional element is electrically connected to at least one of the base substrate and the first base by a connection member.

7. The module according to claim 6,

wherein the first base, the second base and the connection member are coated with a coating member.

8. An electronic apparatus comprising the module according to claim 1.

9. A moving object comprising the module according to claim 1.