MEMS acoustic sensor with integrated back cavity

• US 9,428,379 B2
• Filed: 02/06/2014
• Issued: 08/30/2016
• Est. Priority Date: 03/13/2013
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Ata, Erhan Polatkan, Lim, Martin, Li, Xiang, Lloyd, Stephen, Daneman, Michael Julian
• Primary Examiner(s): GEBREMARIAM, SAMUEL A
• Application Number:
  US14/174,639
• Publication Number:
  US 20140264656A1
• Time in Patent Office: 936 Days
• Field of Search: 257414-418
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2203/053 Translation according to an axis perpendicular to the substrate
• CPC Class Codes: B81B 2203/058 Rotation out of a plane parallel to the substrate
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 3/001 Structures having a reduced contact area, e.g. with bumps or with a textured surface
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A MEMS device is disclosed. The MEMS device comprises a first plate with a first surface and a second surface; and an anchor attached to a first substrate. The MEMS device further includes a second plate with a third surface and a fourth surface attached to the first plate. A linkage connects the anchor to the first plate, wherein the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate. The first plate, second plate, linkage, and anchor are all contained in an enclosure formed by the first substrate and a second substrate, wherein one of the first and second substrates contains a through opening to expose the first surface of the first plate to the environment.

Claims

1. An acoustic sensing device comprising:

a structure with a first surface and a second surface attached to a first substrate;

wherein the structure is contained in an enclosure formed by the first substrate and a second substrate;

wherein the first substrate or the second substrate contains an opening to expose the structure to the environment; and

a variable capacitor, wherein a first electrode of the variable capacitor is formed by a conductive layer on the second substrate and a second electrode of the variable capacitor is formed on the structure;

wherein the structure is displaced in the presence of an acoustic pressure differential between the first and second surfaces of the structure.

2. The device of claim 1, wherein the second electrode is connected to an integrated circuit on the first substrate.

3. An acoustic sensing device comprising:

a structure with a first surface and a second surface attached to a first substrate;

a second substrate attached to the first substrate;

a cap covering the first and second substrates; and

a variable capacitor, wherein a first electrode of the variable capacitor is formed by a conductive layer on the second substrate and a second electrode of the variable capacitor is formed on the structure;

wherein the structure is displaced in the presence of an acoustic pressure differential between the first and second surfaces of the structure;

wherein in the first substrate has a first opening and the second substrate has a second opening to expose the structure to the environment.

4. The acoustic sensing device of claim 3, where in the cap comprises conductive material.

5. The acoustic sensing device of claim 3, where in the cap comprises silicon.

6. An acoustic sensing device comprising:

a structure with a first surface and a second surface attached to a first substrate;

wherein the structure is positioned between the first substrate and a second substrate; and

a variable capacitor, wherein a first electrode of the variable capacitor is formed by a conductive layer on the second substrate and a second electrode of the variable capacitor is formed on the structure;

wherein the structure is displaced in the presence of an acoustic pressure differential between the first and second surfaces of the structure;

wherein the first substrate and the second substrate each contains an opening.

7. The device of claim 6 wherein the second electrode is connected to an integrated circuit on the first substrate.

8. A MEMS device comprising:

an anchor attached to a first substrate;

a first plate with a first surface and a second surface;

a second plate with a third surface and a fourth surface, attached to the first plate; and

a linkage connecting the anchor to the first plate, where the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate;

wherein the first plate, the second plate, the linkage, and the anchor are contained in an enclosure formed by the first substrate and a second substrate;

wherein the first or second substrates contains an acoustic port to expose the first surface to the environment,

wherein at least one electrode is formed on the first substrate,

wherein the second plate moves in an opposite direction of the first plate,

wherein first and second plates are mass balanced around a rotational axis.

9. A MEMS device comprising:

an anchor attached to a first substrate;

a first plate with a first surface and a second surface;

a second plate with a third surface and a fourth surface, attached to the first plate; and

a linkage connecting the anchor to the first plate, where the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate;

wherein the first plate, the second plate, the linkage, and the anchor are contained in an enclosure formed by the first substrate and a second substrate;

wherein the first or second substrates contains an acoustic port to expose the first surface to the environment,

wherein at least one electrode is formed on the first substrate, wherein the second plate moves in an opposite direction of the first plate,

wherein first and second plates are moment of inertia balanced around a rotational axis.

10. A device comprising:

a first sensor and

a second sensor;

wherein the second sensor comprises

an anchor attached to a first substrate;

a first plate with a first surface and a second surface;

a second plate with a third surface and a fourth surface, attached to the first plate; and

a linkage connecting the anchor to the first plate, where the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate;

wherein the first plate, the second plate, the linkage, and the anchor are contained in an enclosure formed by the first substrate and a second substrate;

wherein the first or second substrates contains an acoustic port to expose the first surface to the environment,

wherein at least one electrode is formed on the first substrate.

11. The device of claim 10, wherein the first sensor is at least any of a gyroscope, accelerometer, compass, and a pressure sensor.

12. The device of claim 10, where in the first sensor and the second sensor are enclosed by the first and second substrates.

13. A MEMS device comprising:

an anchor attached to a first substrate;

a first plate with a first surface and a second surface;

a second plate with a third surface and a fourth surface, attached to the first plate;

a third plate formed on the first substrate; and

a linkage connecting the anchor to the first plate, where the first plate and second plate are displaced in the presence of an acoustic pressure differential between the first and second surfaces of the first plate;

wherein the first plate, the second plate, the linkage, and the anchor are contained in an enclosure formed by the first substrate and a second substrate;

wherein the first substrate contains an acoustic port to expose the first surface to the environment,

wherein at least one electrode is formed on the first substrate,

wherein the third plate partially covers the acoustic port.