Touch panel and touch-sensitive display device

• US 9,430,072 B2
• Filed: 08/29/2014
• Issued: 08/30/2016
• Est. Priority Date: 03/10/2011
• Status: Active Grant

• Current Assignee: Wintek Corporation
• Original Assignee: Wintek Corporation
• Inventors: Lin, Yi-Chun, Chou, Cheng-Yi, Wu, Yu-Hua, Wu, Fa-Cheng, Wu, Ming-Kung, Li, Hsiao-Ping, Huang, Ping-Wen, Shiu, Xuan-Chang, Wang, Chih-Yuan, Hsu, Ching-Fu, Liao, Hsiao-Hui, Chang, Ting-Yu, Wang, Wen-Chun
• Primary Examiner(s): Lee, Jr., Kenneth B
• Application Number:
  US14/473,939
• Publication Number:
  US 20140368761A1
• Time in Patent Office: 732 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: G06F 2203/04102 Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/017 Glass ceramic coating, e.g. formed on inorganic substrate
• CPC Class Codes: H05K 2201/09 Shape and layout
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10128 Display

Abstract

A touch panel includes a cover glass, a flexible substrate, and a touch-sensing electrode structure. The flexible substrate is connected to the cover glass via a bonding layer, and the touch-sensing electrode structure is formed on the flexible substrate. The cover glass, the bonding layer, the flexible substrate and the touch-sensing electrode structure are arranged in order, with the flexible substrate being located between the touch-sensing electrode structure and the bonding layer.

Claims

1. A method for manufacturing a touch panel, comprising:

providing a transparent conductive film, a bonding layer, and a temporary base film, wherein the transparent conductive film is joined to one side of the bonding layer, and the temporary base film is joined to the other side of the bonding layer;

patterning the transparent conductive film to form a conductive pattern layer;

forming a protective layer on the conductive pattern layer;

coating a protective covering film on the protective layer; and

peeling off the temporary base film to disclose the bonding layer, and sticking the bonding layer with the conductive pattern layer on a planar or curvy panel.

2. The method for manufacturing a touch panel of claim 1, wherein the patterning step comprises:

forming a plurality of first major conductors and a plurality of second major conductors;

forming a plurality of second conductive wires connected to the second major conductors;

forming an insulation layer on the second conductive wires;

forming a plurality of first conductive wires connected to the first major conductors;

forming a protective layer onto the first major conductors, the second major conductors, and the insulation layer; and

coating a protective covering film on the protective layer.

3. The method for manufacturing a touch panel of claim 2, wherein patterning the first major conductors and the second major conductors is formed by means of laser lithography or photolithography.

4. The method for manufacturing a touch panel of claim 2, wherein forming the first conductive wires and forming the second conductive wires are done by means of ink-jet printing, screen-printing, physical vapor deposition (PVD), or chemical vapor deposition (CVD).

5. A method for manufacturing a touch panel, comprising:

providing a first transparent conductive film, a first bonding layer, and a first temporary base film, wherein the first transparent conductive film is joined to one side of the first bonding layer, and the first temporary base film is joined to the other side of the first bonding layer;

patterning the first transparent conductive film to form a first conductive pattern layer;

providing a second transparent conductive film, a second bonding layer, and a second temporary base film, wherein the second transparent conductive film is joined to one side of the second bonding layer, and the second temporary base film is joined to the other side of the second bonding layer;

patterning the second transparent conductive film to form a second conductive pattern layer;

forming a protective layer on the second conductive pattern layer;

coating a protective covering film on the protective layer; and

peeling off the second temporary base film to disclose the second bonding layer, and sticking the second bonding layer on the first conductive pattern layer.