Wafer-scale package including power source
First Claim
1. A method comprising:
- connecting a control module to one of a first substrate and a second substrate, wherein the first substrate includes at least one of a first semiconductor material and a first insulating material, wherein the second substrate includes at least one of a second semiconductor material and a second insulating material, and wherein the control module is configured to one of determine a physiological parameter of a patient and deliver electrical therapy to the patient;
connecting an energy storage device to one of the first and second substrates;
interfacing the first and second substrates such that the first and second substrates define an enclosed cavity between the first and second substrates, the enclosed cavity including the control module and the energy storage device; and
heating an interface between the first and second substrates to form a bond between the first and second substrates.
1 Assignment
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Accused Products
Abstract
A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
165 Citations
6 Claims
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1. A method comprising:
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connecting a control module to one of a first substrate and a second substrate, wherein the first substrate includes at least one of a first semiconductor material and a first insulating material, wherein the second substrate includes at least one of a second semiconductor material and a second insulating material, and wherein the control module is configured to one of determine a physiological parameter of a patient and deliver electrical therapy to the patient; connecting an energy storage device to one of the first and second substrates; interfacing the first and second substrates such that the first and second substrates define an enclosed cavity between the first and second substrates, the enclosed cavity including the control module and the energy storage device; and heating an interface between the first and second substrates to form a bond between the first and second substrates. - View Dependent Claims (2, 3, 4, 5, 6)
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Specification