Textured encapsulant surface in LED packages
First Claim
1. A light emitting diode (LED) device, comprising:
- first and second electrodes, said first electrode comprising a first top surface, said first and second electrodes are accessible for electrical connection from a side of the LED device opposite said primary emission surface;
a substrate comprising one or more vias, wherein said one or more vias provide a path for current to travel from said side of the LED device opposite said primary emission surface;
a plurality of LED chips entirely on said first top surface; and
an encapsulant disposed proximate to said mount surface, said encapsulant comprising a textured primary emission surface and at least one side emission surface;
wherein all of said first top surface is covered by said encapsulant and wherein said plurality of LED chips and said encapsulant are configured such that light can be emitted from said LED device from said at least one side emission surface;
wherein all of a top surface of said substrate adjacent to said encapsulant is covered by at least a portion of said encapsulant such that said encapsulant extends to the edges of said top surface of said substrate.
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Accused Products
Abstract
A packaged LED device having a textured encapsulant that is conformal with a mount surface on which at least one LED chip is disposed. The textured encapsulant, which can be textured using an additive or subtractive process, is applied to the LED either prior to or during packaging. The encapsulant includes at least one textured surface from which light is emitted. The textured surface helps to reduce total internal reflection within the encapsulant, improving the extraction efficiency and the color temperature uniformity of the output profile. Several chips can be mounted beneath a single textured encapsulant. A mold having irregular surfaces can be used to form multiple encapsulants over many LEDs simultaneously.
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Citations
28 Claims
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1. A light emitting diode (LED) device, comprising:
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first and second electrodes, said first electrode comprising a first top surface, said first and second electrodes are accessible for electrical connection from a side of the LED device opposite said primary emission surface; a substrate comprising one or more vias, wherein said one or more vias provide a path for current to travel from said side of the LED device opposite said primary emission surface; a plurality of LED chips entirely on said first top surface; and an encapsulant disposed proximate to said mount surface, said encapsulant comprising a textured primary emission surface and at least one side emission surface; wherein all of said first top surface is covered by said encapsulant and wherein said plurality of LED chips and said encapsulant are configured such that light can be emitted from said LED device from said at least one side emission surface; wherein all of a top surface of said substrate adjacent to said encapsulant is covered by at least a portion of said encapsulant such that said encapsulant extends to the edges of said top surface of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification